... CIRCUIT | A circuit comprised of mostly integrated circuits which operates like a switch(i.e., it is either "ON" or "OFF"). | DIGITIZING | The | CIRCUIT BOARDS | process of reducing feature locations on a flat plane to digital representation of X-Y coordinates. | DIMENSIONAL HOLE | A hole in a printed board | CIRCUIT BOARDS | where the means of determining location is by coordinate values not necessarily coinciding with the stated grid. | DIMENSIONAL STABILITY | A freedom from distortion | CIRCUIT BOARDS | caused by such factors as temperature, humidity, chemical treatment, age, or stress. | DIP SOLDERING | A process whereby printed boards are brought in contact | CIRCUIT BOARDS | with the surface of a static pool of molten solder for the purpose of soldering the entire exposed conductive pattern in one operation. | DISCRETE | CIRCUIT BOARDS | COMPONENT | A component which has been fabricated prior to its installation (i.e., resistors,capacitors, diodes and transistors) | DRY FILM RESISTS COATING MATERIALS | specifically | CIRCUIT BOARDS | designed for use in the manufacture of printed ...
[ Circuit Boards ]


... is available in sizes up to 490mm x 290mm maximum, whereby the individual PCBs with milling fixing tabs of 1.5mm must be kept below | CIRCUIT BOARDS | this size. | THE MILLING GROOVE | for the outer contour is 2.4 mm. The boards are milled in accor-dance with the dimensionlayer, which must | CIRCUIT BOARDS | be a separate layer containing just the unbroken contour of the boards (edge markings or drawings are not suitable and result in additional charge). | | CIRCUIT BOARDS | SELECTED CAPABILITIES: | Archiving Process Data Drill- / Milling Program Archiving Customer Data Production Data Conversion E-Test optional Design Check UL - approval Design Adjustment | CIRCUIT BOARDS | Further Options | TECHNICAL SPECIFICATION: | "Delivery: Multi-Panel (MP): Delivery-Size of the Panelized Board Array is 490 mm x 290 mm with Fixing Tabs by | CIRCUIT BOARDS | Min-Distance between the Boards of 2,4 mm. | MILLING-COORDINATES [-?-]: | One MAA-Unit (MAA-U) is made up of 20 MAA´s | DATA-BASE FORMAT: | Gerber, | CIRCUIT BOARDS | ODB++, DPF Type of the Base Material: FR 4 Layers: 1, 2, 4 | SURFACE PROTECTION: ...
[ Circuit Boards ]


... | A process wherein printed boards are brought in contact with a gently overflowing wave of liquid solder which is circulated by a pump | CIRCUIT BOARDS | in an appropriately designed solder pot reservoir. The prime functions of the molten wave are to serve as a heat source and heat transfer medium | CIRCUIT BOARDS | and to supply solder to the joint areas. | WEBBING | Unwanted threadlike deposits of solder on insulated areas. | WETTING | The formation of | CIRCUIT BOARDS | a relatively uniform, smooth, unbroken, and adherent film of solder to a base material immediately upon contact. | WIRE-BONDING | Connecting technique using thin metal | CIRCUIT BOARDS | wire connections between a component and the ...
[ Circuit Boards ]