... help you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can | CIRCUIT BOARDS FAB | be supplied as | ARTWORKS |, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard | CIRCUIT BOARDS FAB | that will enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These | CIRCUIT BOARDS FAB | marks could be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the | CIRCUIT BOARDS FAB | boards made inside out). | IMAGES | should comply with design rules that will result in a board that will meet performance and cost requirements. | CIRCUIT BOARDS FAB | - | SCALE MUST BE GIVEN, | tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the | CIRCUIT BOARDS FAB | backing sheet clean. - Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for | CIRCUIT BOARDS FAB | blocking light ...
[ Circuit Boards Fab ]... en masse and must be stepped out into a panelized form. The result: Data sets with lots of unnecessary positive planes swell exponentially, bog | CIRCUIT BOARDS FAB | down CAM systems, and crash photoplotters. After the basic prep work is completed, step into the fabrication | PRINTED CIRCUIT BOARDS | analysis arena, where | CIRCUIT BOARDS FAB | the game is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and balances can resolve any conflicts between the | CIRCUIT BOARDS FAB | two. | TAKE SOLDERMASK LAYERS |, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that is, there is not much | CIRCUIT BOARDS FAB | in the way of capability checking within the tool. As a result, these are among the more troublesome layers for fabricators. The solution here is | CIRCUIT BOARDS FAB | a fabrication analysis tool that can handle such issues as clearances, coverage, webbing, and so forth. For instance, most fab shops want the largest possible | CIRCUIT BOARDS FAB | | CLEARANCES | in a solder layer so that mask doesn't end up on pads. On the flip side, ...
[ Circuit Boards Fab ]... even when a drill file is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must | CIRCUIT BOARDS FAB | be clearly represented with distinct differences between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred | CIRCUIT BOARDS FAB | with overall mechanical dimensions including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless | CIRCUIT BOARDS FAB | different to our standard of + / -0.25 mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std | CIRCUIT BOARDS FAB | = 18mm) solder mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement | CIRCUIT BOARDS FAB | (std for multilayer and fine line production runs) Extra information required for multilayers includes: special dielectric spacing requirements (if important) copper thickness of ...
[ Circuit Boards Fab ]