... Often used with the industry to identify a method for preparing thlaminate substrate for multilayer PCB's i.e., the mass laminator not only laminated a | CIRCUIT BOARDS MAKER | number of layers of the multilayer board, but also performs fabrication steps on the inner layers of circuitry. This allows the fabricator to produce the | CIRCUIT BOARDS MAKER | outer layer circuitry to complete the multilayer board. | MICRO HOLES | Are pruduced mechanically. Availabale drilling tools ave Dieameter down to a minimum of | CIRCUIT BOARDS MAKER | 0,1 mm. Threfore both partial and through-vias can be conventionally drilled. | MICROSECTIONING | The preparation of a specimen for the microscopic examination of the | CIRCUIT BOARDS MAKER | material to be examined, usually by cutting out a cross-section followed by encapsulation, polishing, etching, staining, etc. | MID | (3-D) 3-dimensional molded interconnect devices | CIRCUIT BOARDS MAKER | | MINIMUM ANNULAR RING | The minimum width of metal, at the narrowest point, between the edge of the hole and the outer edge of | CIRCUIT BOARDS MAKER | the terminal area. This measurement is made to ...
[ Circuit Boards Maker ]... | PRINTED CIRCUIT BOARDS | The spirtit of our work and the measures to be taken are determined by the conscience to meet our | CIRCUIT BOARDS MAKER | customer`s needs. Quality concerns everybody in our company. Our executive staff must show an exemplary and leading behaviour in every aspect of quality. Development and | CIRCUIT BOARDS MAKER | promotion of fault avoiding working spirit. A cooperative management style is the first condition for involving our employees in the process of solving problems. | | CIRCUIT BOARDS MAKER | MISSION STATEMENT | (Aims and strategies in our policy of quality) "We are dedicated to total customer satisfaction through continuous improvement in quality, technology and | CIRCUIT BOARDS MAKER | cycle times. (For us quality is the creation of a product that meets our customer`s requirements at 100 percent. This means precisely not only to | CIRCUIT BOARDS MAKER | guarantee the physical and functional attributes of a product but also every aspect of service linked to the ...
[ Circuit Boards Maker ]... costs, as was chemical tin. Both procedures have proven to be very complicated and sensitive in the further course of processing management. Lead-free solderings | CIRCUIT BOARDS MAKER | also have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher processing temperatures and copper leaching effects. would briefly like to explain | CIRCUIT BOARDS MAKER | why chemical silver is the lead-free procedure of the future, and why it will be the focus of our future investments in the field of | CIRCUIT BOARDS MAKER | surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of copper and | CIRCUIT BOARDS MAKER | the more “precious” silver. The advantages of this processing manner compared with chemical tin are fewer processing steps and lower rinsing temperatures (30 – 50 | CIRCUIT BOARDS MAKER | C°). From the printed circuit board manufacturer’s viewpoint, one strong point in favour of the silver procedure is the fact that waste water processing is ...
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