... This is a further alternative to the hot air levelled solder and electroless nickel / immersion gold finishes. It is an organic solderability preservative | CIRCUIT BOARDS MANUFACTURING | (OSP) and is normally applied after the screen printing and profiling stages of manufacture. Boards to be treated are chemically etched, cleaned and dried before | CIRCUIT BOARDS MANUFACTURING | being passed through a flood rinse module containing the OSP solution. This solution reacts chemically with the clean copper to form a thin layer of | CIRCUIT BOARDS MANUFACTURING | an organic complex some 0.3 microns thick. Results are monitored on a regular basis by coating test panels and assessing the thickness achieved by UV | CIRCUIT BOARDS MANUFACTURING | spectrometric means. Following treatment, the boards are rinsed to remove residues and dried to obtain a uniform film. Further drying completes the curing of the | CIRCUIT BOARDS MANUFACTURING | film, which then protects the underlying copper from environmental influences and subsequent multipass processing by the customer. Immersion Tin Protection (alternativ) A new modern alternative | CIRCUIT BOARDS MANUFACTURING | to hot air solder ...
[ Circuit Boards Manufacturing ]


... to the imaging operation. Image LPI Mask Dried solder mask is imaged in a manner similar to that used for imaging the circuitry. Phototools | CIRCUIT BOARDS MANUFACTURING | containing black areas where the solder mask is to be removed are placed in direct contact with both sides of the panel. The panel is | CIRCUIT BOARDS MANUFACTURING | then exposed to UV light. The amount of light used is controlled by an integrator. Printing is done with a semi-automatic dual drawer printer. While | CIRCUIT BOARDS MANUFACTURING | one drawer is being loaded with a panel and phototools, the other is inside the machine being exposed. This dual drawer printing system runs at | CIRCUIT BOARDS MANUFACTURING | the same rate as the screen printer to insure continuous flow. Develop LPI Mask After the panel has been exposed, it is placed in a | CIRCUIT BOARDS MANUFACTURING | vertical developer. The unexposed solder mask is dissolved in a high pressure spray of developing solution. The solution temperature, concentration and conveyor speed control the | CIRCUIT BOARDS MANUFACTURING | development process. The developer solution concentration is maintained by a feed and bleed system controlled by ...
[ Circuit Boards Manufacturing ]


... refinement uncomplicated and reliable, but once the manufacturing parameters have been set they can be dependably utilised for further processing and continued use. Due | CIRCUIT BOARDS MANUFACTURING | to the thin surface layer – a thickness of 0.15 – 0.3 mµ is recommended – the surface of the pad is smoother and therefore | CIRCUIT BOARDS MANUFACTURING | there are, even in fine pitch areas, no restrictions when assembling. The silver functions merely as a protection against oxidation, and the actual solder point | CIRCUIT BOARDS MANUFACTURING | is between the copper and chemical tin, therefore the solder point is absolutely stable. It fulfills all UL requirements (UL796 specif.) and meets the usual | CIRCUIT BOARDS MANUFACTURING | requirements of automobile manufacturers: Test AlphaSTAR Result Requirement SIR 85°C/85%RH 2.46+9 24h Passed >1E+8;IPC-4553 IPC-TM-650 2.6.3.5. 3.15E+9 96h Passed SIR 35°C/85%RH 100VDC 3.56E+11 24h Passed | CIRCUIT BOARDS MANUFACTURING | >1E+10;IPC-4553 and GR-78 (Bellcore) IPC-TM-650 2.6.3.5 4.62E+11 96h Passed EM 10V bias, 100V Test, 2.46E+9 24h initial Resistance no higher than the Power of 10 | CIRCUIT BOARDS MANUFACTURING | 85°C/85%RH ...
[ Circuit Boards Manufacturing ]