... has long been an established surface refining process among printed circuit board techniques. However, in spite of many advantages over conventional solder levelling it | CIRCUIT BOARDS PLANT | has only been adopted for certain application areas. Nickel gold is utilized in particular where PCB surfaces are exposed to aggressive environments, for instance in | CIRCUIT BOARDS PLANT | mobile phones, or automobile electronics. Due to the consistent chemical precipitation of metal, gold is the obvious choice for all fine-pitch assemblings with under 0,5 | CIRCUIT BOARDS PLANT | mm grid spaces. Due to its smooth excellence, the immersion nickel gold surface is a better alternative to HAL, particularly for narrow SMD grids on | CIRCUIT BOARDS PLANT | both side of PCB`s. The actual wiring of a component is effected by means of a 4-6 my thick layer of nickel, and not by | CIRCUIT BOARDS PLANT | means of the extremely fine 0,05 to 0,2 my layer of gold which merely serves as an oxidation and diffusion blockage in order to extend | CIRCUIT BOARDS PLANT | the soldering conditions. Thicker gold layers, up to 0,3 my, are only targeted for ...
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... immediatedly afterwards. The time after drying should not exceed 48 hours not to rise the risk of delamination again. | FORMING MICROVIAS |. (Demand | CIRCUIT BOARDS PLANT | for small holes is ramping, with CO2 lasers leading the way) Thanks largely to the proliferation of smaller, more complex electronics devices such as cell | CIRCUIT BOARDS PLANT | phones, personal digital assistants, and notebook computers, the PCB industry is experiencing an overwhelming rise in demand for high-density interconnect structures (HDIS). The demand for | CIRCUIT BOARDS PLANT | HDIS translates directly into a vigorous market for the microvias used in many of these multilayer substrates as well as in conventional PCBs. In 1998, | CIRCUIT BOARDS PLANT | for example, the worldwide microvia market made up about four percent of the total multilayer PCB market. By 2007 that market share is expected to | CIRCUIT BOARDS PLANT | expand to nearly 30 percent (Figure 1). Figure 1. Estimates predict | MICROVIA BOARDS | will comprise 29 percent of all buildup boards by 2007. | CIRCUIT BOARDS PLANT | Worldwide, the | TOTAL MICROVIA | market approached ...
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... hier an einem typischen Beispiel aufgezeigt und vorgerechnet. Langjährige Erfahrungen zeigen, dass der Einkauf in China durchschnittlich nicht mehr als 5 bis 10 % | CIRCUIT BOARDS PLANT | Ersparnis bringt. Diese wiegt aber nicht in allen Fällen die damit verbundenen Nachteile auf... | PREISVERÄNDERUNG IN CHINA | Die Vorprodukte*, Metalle. Gestiegene Rohstoffkosten setzen | CIRCUIT BOARDS PLANT | die Elektronikbranche weltweit unter Druck. Von Jahresanfang bis Ende Mai stiegen die Weltmarktpreise für Metalle (Ag, Al, Au, Cu, Ni, Sn) stark an. Zwar fielen | CIRCUIT BOARDS PLANT | die Notierungen bis Anfang August wieder, sind aber immer noch erheblich höher als zu Jahresbeginn. Stellvertretend für alle Metalle sei hier Kupfer genannt. Der Kupferpreis | CIRCUIT BOARDS PLANT | stieg von... | MAKROÖKONOMISCH VOLLKOMMEN IDIOTISCH | Auszug aus "Markt&Technik" Nr. 23 vom 03.06.2005 zum Thema "Standort Deutschland II" | TROTZ SCHLECHTER RAHMENBEDINGUNGEN | - | CIRCUIT BOARDS PLANT | dass sich Leiterplatten auch am Standort Deutschland wett- bewerbsfähig produzieren lassen, davon ist Andreas Brüggen, ...
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