... OSP is basically just a one-step process. Chemical tin, chemical silver and chemical nickel-gold are therefore, far more expensive; HAL only marginally so. Doubts | CIRCUIT BOARDS PRODUCE | - just a European attitude? So, what are the disadvantages ? European users, in particular, can list quite a few: the predominant one being, that | CIRCUIT BOARDS PRODUCE | for mixed components and other multi-thermic processes, the organic protection layer breaks off at temperatures above 150° C . All in all, the area of | CIRCUIT BOARDS PRODUCE | use for soldering at higher melting temperatures has not yet been reliably tested. In addition, OSP does not bond. The ability to bond with soldering | CIRCUIT BOARDS PRODUCE | paste – in particular with lead-free soldering paste – depends greatly on the soldering procedure, such as convection ovens with or without a nitrogen atmosphere, | CIRCUIT BOARDS PRODUCE | high cooker ovens, etc Tests so far show that bonding is not as good as with the other named surfaces. Therefore, the self-centralising effect is | CIRCUIT BOARDS PRODUCE | noticeably lower and requires greater precision of solder paste ...
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... CAD data supplied to us are checked using a standard design rule check and customized DFM- functions, which has been drawn up in accordance | CIRCUIT BOARDS PRODUCE | with the required IPC guidelines, our capability matrix and customer´s engineers. If you have any questions regarding this issue, please contact the head of our | CIRCUIT BOARDS PRODUCE | pre-production office, Mr. Vornholt. Should the CAD data prove not to be suitable for production, the person responsible for the data will be contacted by | CIRCUIT BOARDS PRODUCE | the pre- production engineer dealing with the order. 3.4 Order confirmation After the clearance of all technical and commercial details, an order confirmation is sent | CIRCUIT BOARDS PRODUCE | to the customer. The order confirmation contains the following details (rough outline): 1. Basic technical data (dimensions of pcb; type of multilayer construction etc.) 2. | CIRCUIT BOARDS PRODUCE | Basic commercial data (ordered quantities; delivery time; pricing etc.) 3. Electrically tested or not electrically tested 4. Terms of delivey 5. Terms of payment. 6. | CIRCUIT BOARDS PRODUCE | Reference to our Terms of Trade ...
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... (based on the copper weight requirement). * Plating balance of parts on the panel. * Hole size based on plating requirement. * Drill hit | CIRCUIT BOARDS PRODUCE | optimization. * Spacing for the shearing of parts that require gold tip plating. * Thieving on part, if necessary. * Panel border minimums. * Piece | CIRCUIT BOARDS PRODUCE | size minimums if tested via flying probe tester (test in piece or in panel form). * Where the cross- section process should take place or | CIRCUIT BOARDS PRODUCE | whether it should take place in multiple processes. * Organization of any special tools (drill or router bits, for example) for "out of the ordinary" | CIRCUIT BOARDS PRODUCE | processes. * Material availability, either in-house or on order (and the latter's delivery schedule). * UL capability. Tip: Have a pre-order check, or educate the | CIRCUIT BOARDS PRODUCE | sales team about facility capabilities. The planner must know the manufacturing facility and its capabilities. By giving the process engineering department an opportunity to evaluate | CIRCUIT BOARDS PRODUCE | the process traveler and artwork, the planner will not only have a ...
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