... fabricator "reverse engineering" the netlist from the Gerber files. Next up are the internal plane layers. For some reason, CAD engineers like them to | CIRCUIT BOARDS PRODUCTION | be "positive," but those types of layers lead to huge file sizes. Negative plane layers are usually preferred by fabricators because they're easier to work | CIRCUIT BOARDS PRODUCTION | with and have smaller file sizes than positive layers. Remember, boards are manufactured en masse and must be stepped out into a panelized form. The | CIRCUIT BOARDS PRODUCTION | result: Data sets with lots of unnecessary positive planes swell exponentially, bog down CAM systems, and crash photoplotters. After the basic prep work is completed, | CIRCUIT BOARDS PRODUCTION | step into the fabrication analysis arena, where the game is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and | CIRCUIT BOARDS PRODUCTION | balances can resolve any conflicts between the two. Take soldermask layers, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that | CIRCUIT BOARDS PRODUCTION | is, there is not much in the way of capability ...
[ Circuit Boards Production ]


... PRINTED CIRCUIT BOARDS |! Here we have chosen specific topics you have ask for to help you finding a suitable answer. Please click a | CIRCUIT BOARDS PRODUCTION | topic below to view frequently asked questions in that topic. Error Highlights > Do you have a list with tips, in order to avoid errors | CIRCUIT BOARDS PRODUCTION | in the apron? | DIN EN ISO 9001:2000 > ARE YOU CERTIFIED? | | HOTSHOT > DO YOU OFFER SUCH A SERVICE? | Methods of | CIRCUIT BOARDS PRODUCTION | Shipment > Which modes of shipment do you offer? Standard lead times > Surcharge? UL-Approval > What and for which is that? Delivery in Panelized | CIRCUIT BOARDS PRODUCTION | Boards (PB) > What is to be considered? Design Rule Check (DRC) > What is that? MAA's Basic Jet Line> What are MAA's and how | CIRCUIT BOARDS PRODUCTION | can i calculate this? Multi-Panel (MP) > What is that and which one must consider? Surface (2) > RoHS-Compliance (leadfree)? Test Points > How can | CIRCUIT BOARDS PRODUCTION | i calculate the test points? Working Days > What is your definition of a working day? You may also be interested in... Password > Which | CIRCUIT BOARDS PRODUCTION | syntax is permitted? Value Added Tax (VAT) > When will it ...
[ Circuit Boards Production ]


... DIRECT METALLIZATION SYSTEM FOR PRINTED CIRCUIT BOARDS | Features/Benefits Selective to Dielectric and Glass Total Process Cost Reduction Environmentally Sound Excellent Copper-to-Copper Adhesion and | CIRCUIT BOARDS PRODUCTION | Through-Hole Coverage Horizontal and Vertical Process Compatibility No Hole Size, MLB Layer Count or Aspect Ratio Limitations Suitable for PTH Innerlayer or Microvia Metallization CHARACTERISTICS: | CIRCUIT BOARDS PRODUCTION | - excellent copper to copper adhesion - no additional etching will be necessary for copper-cleaning - no residuals in blind-micro-Via´s The DMS-E direct metallization system | CIRCUIT BOARDS PRODUCTION | selectively deposits highly conductive polymer on dielectric resin and glass areas without the use of electroless copper. The formaldehyde-free, environmentally sound technology provides fast and | CIRCUIT BOARDS PRODUCTION | uniform coverage of the plated through-hole. DMS-E selective catalyzation ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. Innerlayer and outerlayer copper surfaces remain | CIRCUIT BOARDS PRODUCTION | pristine, ...
[ Circuit Boards Production ]