Circuit Boards Technologies OSP (Organic Surface Protection) for Printed Circuit Boards.

... for printed circuit boards! Here we have chosen specific topics you have ask for to help you finding a suitable answer. Please click a | CIRCUIT BOARDS TECHNOLOGIES | topic below to view frequently asked questions in that topic. Bank account foreign country > What are the details? PayPal (PP) > What are the | CIRCUIT BOARDS TECHNOLOGIES | advantages of this payment method ? Direct Debit (DB) only valid in Germany > What does this means ? Payment in advance (PA) > When | CIRCUIT BOARDS TECHNOLOGIES | are you starting wiht the production? Payment Method > Wich options i have? PayPal (PP) > What are the advantages of this payment method ? | CIRCUIT BOARDS TECHNOLOGIES | You may also be interested in... Password > Which syntax is permitted? Value Added Tax (VAT) > When will it be charged? On-line Ordering > | CIRCUIT BOARDS TECHNOLOGIES | What means | PRINTED CIRCUIT BOARDS | status of 1,2 etc.? If one of your | QUESTIONS | could not be answered, send us please | CIRCUIT BOARDS TECHNOLOGIES | your question by the form for contact, or call: (++49)- 21 ...
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... to HAL (Hot Air Levelling) with these wonderful features, at least from the point of view of the PCB manufacturer. OSP is an organic | CIRCUIT BOARDS TECHNOLOGIES | solution based on an imidazole substitute which, by means of dipping or rinsing can be selectively applied to the copper surfaces, ready for soldering. A | CIRCUIT BOARDS TECHNOLOGIES | transparent layer, max. 0.2 to 0.6 my thick, covers the copper like a barely visible clear varnish. COMPLETELY LEVEL THANKS TO DIRECT CONTACT WITH THE | CIRCUIT BOARDS TECHNOLOGIES | COPPER Purely as a sealing agent, OSP offers good preconditions to adhere components that require an absolutely level surface, thanks to the fact that the | CIRCUIT BOARDS TECHNOLOGIES | soldering paste is applied directly to the copper. The common problem of twisted fine-pitch components due to raised “tin bubbles” on the HAL surface is, | CIRCUIT BOARDS TECHNOLOGIES | therefore, a thing of the past. The impress technique can be more precise with OSP, if one considers how much firmer the copper is because | CIRCUIT BOARDS TECHNOLOGIES | of its direct contact with the component. The varnish forms an airtight cover to the copper surface ...
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... to the PCB as well as soldered. Immersion tin demonstrates a good soldering ability, but is slightly at a disadvantage compared with SnPb, because | CIRCUIT BOARDS TECHNOLOGIES | the thin immersion tin layer cannot be completely dissolved. Multi-soldering is possible, as well as pressing techniques, thanks to the thinness of the layer. The | CIRCUIT BOARDS TECHNOLOGIES | thin tin layer does, however, has its disadvantages. The inter-metallic copper-tin phase is approx. 0,25 mµ thick when delivered. During storage, the diffusion of copper | CIRCUIT BOARDS TECHNOLOGIES | in the tin surface continues, causing the thickness of the pure copper or tin layers to decrease. If the blended metal reaches the surface it | CIRCUIT BOARDS TECHNOLOGIES | becomes coated with a non- removable oxide, making soldering impossible. Storage possibilities of immersion tin PCBs are, for this reason, considerably limited compared with conventional | CIRCUIT BOARDS TECHNOLOGIES | SnPb techniques: stored PCBs should be used up within 3 months and if time exceeds 6 months, heavy processing problems can occur. The price of | CIRCUIT BOARDS TECHNOLOGIES | immersion tin is between that of the ...
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