... up to 5µ nickel Immersion nickel/ (bond) gold* 0,3µ gold up to 5µ nickel Immersion chemical tin* 1µ very high planarity Organic surface protection | MULTILAYER BOARDS | (OSP) organic coating of copper ENTEK PLUS Cu - 106 5.8 Text printing, additional printing techniques Silk screen printing Standard µ Special µ Technical limit | MULTILAYER BOARDS | µ Silk screen to Pads spacing 300 250 200 Silk screen to PTH spacing 300 250 200 Line width 200 175 140 Minimum size of | MULTILAYER BOARDS | letters 1250 1000 800 Carbon key pad printing Standard (µ) Special (µ) Technical limit (µ) Track to track spacing 500 400 400 Minimum track width | MULTILAYER BOARDS | 500 400 300 Peelable mask Standard Special Technical limit Max diameter of covered holes 1,8 mm 2,0 mm 2,6*mm Thickness of peelable mask 300µ 400µ | MULTILAYER BOARDS | 500µ *coverage cannot be guaranteed 5.9 Contour machining Contouring is performed by three possible techniques: * Routing * V-cutting These techniques allow contouring within the | MULTILAYER BOARDS | standard „DIN 7168 mittel“ (medium accuracy) and „fein“ (precise accuracy). Dependant on the ...
[ Multilayer Boards ]


... Drilling-Department CNC - Driller Guide to Documentation Requirements Images To help you quickly access the services we offer, the following is a guide to | MULTILAYER BOARDS | the preferred requirements for producing quality Printed Circuit Boards. Can be supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and | MULTILAYER BOARDS | registration of the images is of a standard that will enable a good quality board to be produced. Another important criteria is the presence of | MULTILAYER BOARDS | orientation marks within the boundary of board. These marks could be the board reference so long as it cannot be read from the other side. | MULTILAYER BOARDS | (This is for your protection to prevent the boards made inside out). Images should comply with design rules that will result in a board that | MULTILAYER BOARDS | will meet performance and cost requirements. - Scale must be given, tapes securely stuck to the backing sheet, track to pad & track to track | MULTILAYER BOARDS | joints complete and the backing sheet clean. - Scale must be given and be at least 2:1. Plots must ...
[ Multilayer Boards ]


... - With Electrical Testing | ESPECIALLY DURING THE LAST FEW YEARS | we succeeded in realizing new sophisticated concepts of automatisation, flexibility and other | MULTILAYER BOARDS | improvements in production techniques. Therefore we are able to offer state-of-the-art quality for a rate beating world market prices. As in times of radical cuts | MULTILAYER BOARDS | in the | "TIME-TO-MARKET" | cycle, our "Rapid Mass Production" (high-speed/high volume) enables you to be one step ahead in your product launch. Moreover excellent | MULTILAYER BOARDS | preparation of the artwork and engeneering performance shall guarantee that your choice is a great advantage in times of ruthless competition. Thanks to our own | MULTILAYER BOARDS | | INNOVATIVE AUTOMATION CONCEPTS |, flexibility and our efforts to be the best, we are able to produce PCBs at highest possible level of quality | MULTILAYER BOARDS | and prices, being competitive worldwide. As the role of PCBs gets more and more decisive for the business success in times of shortening time to | MULTILAYER BOARDS | market cycles, the PCB offers more potential for saving ...
[ Multilayer Boards ]