... high resolution image analysis system. From this information, the computer creates a three-dimensional map of the circuit structure image concealed beneath the copper foil. | MULTILAYER BOARDS FAB | This data enables either the best possible positioning of pinning holes for further processing on other CNC machines, or the layers of each individual multi | MULTILAYER BOARDS FAB | layer can be aligned and operated with the local CNC routine. Bordering takes place at the same time to remove the copper and epoxide projections | MULTILAYER BOARDS FAB | from the edges of the Panel and to achieve its specified dimensions Of course the layer recognition routine takes longer than a conventional CNC procedure, | MULTILAYER BOARDS FAB | but it is not presumptuous to claim that immediately after pressing the multi layer has the quality of a plated throug circuit The art of | MULTILAYER BOARDS FAB | viewing chicken eggs clearly. Although the fundamental idea appears ingeniously simple, the most sophisticated German technology was necessary to carry it out. It was extremely | MULTILAYER BOARDS FAB | complicated to develop a camera system which can ...
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... a pattern, components, or both, from the edges of the printed board. | EDGE-BOARD CONTACT | A series of contact printed on or near | MULTILAYER BOARDS FAB | any edge of a PCB and intended for mating with an edge connector. | ELECTROLESS DEPOSITION | The deposition of conductive material from an autocatalytic | MULTILAYER BOARDS FAB | plating solution without application of electrical current. | ELECTROPLATING | The electrodeposition of an adherent metal coating on a conductive object for protection, decoration, or | MULTILAYER BOARDS FAB | other purposes. The object to be plated is placed in an electrolyte and connected to one terminal of a DC voltage source. The metal to | MULTILAYER BOARDS FAB | be deposited is similarly immersed and connected to the other terminals. Ions of the metal provide transfer to metal as they make up the current | MULTILAYER BOARDS FAB | flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been deposited onto the edges of the conductive pattern during drilling. Also called Resin | MULTILAYER BOARDS FAB | Smear. | ETCH FACTOR | The ratio of the depth of etch (conductor thickness) to the amount of ...
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... BOARDS | In analysing the one realizes that this is something which is never influenced by an external trainer, but that the athlete alone | MULTILAYER BOARDS FAB | must deal with this critical moment. The receiving athlete, in particular, must adapt with lightening speed to conditions that are never the same, i.e. to | MULTILAYER BOARDS FAB | the speed, rhythm and movements of the previous runner, as well as to the positions of his opponents. This situation is therefore solved de-centrally, at | MULTILAYER BOARDS FAB | the place of action. This is exactly the principle that we have adopted in our production. Although logistics and distribution still determine when an order | MULTILAYER BOARDS FAB | must be completed, it is the operators in the departments themselves who are responsible for the regulation of a smooth flow of production. From the | MULTILAYER BOARDS FAB | first production step, the respective operators promise to complete all RMP orders by a certain date. In this way the operator responsible for the subsequent | MULTILAYER BOARDS FAB | step can have all of his technical and organisational equipment fully prepared ...
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