Multilayer Boards Maker Printed Circuit Boards (PCBs) range: Rapid Proto-Typing | In Medium to High Volume | In Rapid Mass-Production.

... humidity away is not really reliable. C STORAGE TIME The storage time of PCB`s should be as short as possible. PCB`s should be taken | MULTILAYER BOARDS MAKER | out due to the „first-in, first out“ rule. The the polyethylene packages should be taken away just before the assembling. Remaining PCB`s should be repacked | MULTILAYER BOARDS MAKER | again. To avoid exposure to draught, the packages should be stored in boxes. D SOLDERING TESTS PCB`s stored for over several months and being transported | MULTILAYER BOARDS MAKER | under questionable conditions, should be submitted again to a soldering test, being equivalent to your soldering process. E HEAT CONDITIONING OF THE PCB`S In any | MULTILAYER BOARDS MAKER | case we suggest a drying process of the PCB`s in a stove to reduce the moisture in the PCB`s to an acceptable minimum. Following parameters | MULTILAYER BOARDS MAKER | can be recommended: Drying time: C° 8 hours 120 10 hours 100 18 hours 80 Lower drying temperatures are also possible but need much more | MULTILAYER BOARDS MAKER | exposure time. We also suggest to put the PCB`s vertically in the stove by using a rack. Good results can be ...
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... base metal is not exposed. | DIELECTRIC | Any insulating medium which intervenes between two conductors. | DIELECTRIC | Breakdown A complete failure of | MULTILAYER BOARDS MAKER | a dielectric material characterized by a disruptive electrical discharge through the material due to a sudden and large increase in voltage. | DIELECTRIC STRENGTH | | MULTILAYER BOARDS MAKER | The maximum voltage that an insulating material can withstand before breakdown occurs. | DIGITAL CIRCUIT | A circuit comprised of mostly integrated circuits which operates | MULTILAYER BOARDS MAKER | like a switch(i.e., it is either "ON" or "OFF"). | DIGITIZING | The process of reducing feature locations on a flat plane to digital representation | MULTILAYER BOARDS MAKER | of X-Y coordinates. | DIMENSIONAL HOLE | A hole in a printed board where the means of determining location is by coordinate values not necessarily | MULTILAYER BOARDS MAKER | coinciding with the stated grid. | DIMENSIONAL STABILITY | A freedom from distortion caused by such factors as temperature, humidity, chemical treatment, age, or stress. | MULTILAYER BOARDS MAKER | | DIP SOLDERING | A process whereby ...
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... and should contain the following information to ensure that the finished board is to your requirements. - Always required even when a drill file | MULTILAYER BOARDS MAKER | is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences | MULTILAYER BOARDS MAKER | between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, | MULTILAYER BOARDS MAKER | cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + | MULTILAYER BOARDS MAKER | / -0.25 mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std | MULTILAYER BOARDS MAKER | = green) solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line | MULTILAYER BOARDS MAKER | production runs) Extra ...
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