... no components installed. | BASE COPPER | The thin copper foil portion of a copper- clad laminate for PCB's that can be present on | MULTILAYER BOARDS PLANT | one or both sides of a board. | BASE MATERIAL | The insulating material upon which the conductive pattern may be formed. The base material | MULTILAYER BOARDS PLANT | may be rigid or flexible. | BASIC DIMENSION | A numerical value used to describe the theoretical exact location of a feature or hole. It | MULTILAYER BOARDS PLANT | is the basis from which permissible variations are established by tolerance on other dimensions, in notes, or by feature control symbols. | BLIND VIA | | MULTILAYER BOARDS PLANT | A plated through hole, connecting inner layers of multilayer board, that penetrates to one Outer-Layer. | BLISTER | A localized swelling and separation between any | MULTILAYER BOARDS PLANT | of the layers of a laminated base material, or between base material and conductive foil. It is a form of delamination. | BOND STRENGTH | | MULTILAYER BOARDS PLANT | A measure of force or pressure required to separate a layer of material from its base. This may be measured as peel strength, in pounds ...
[ Multilayer Boards Plant ]


... access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can be supplied as | MULTILAYER BOARDS PLANT | artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard that will enable a good | MULTILAYER BOARDS PLANT | quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could be the board | MULTILAYER BOARDS PLANT | reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made inside out). Images | MULTILAYER BOARDS PLANT | should comply with design rules that will result in a board that will meet performance and cost requirements. - Scale must be given, tapes securely | MULTILAYER BOARDS PLANT | stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. - Scale must be given and | MULTILAYER BOARDS PLANT | be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light when photographing. - ...
[ Multilayer Boards Plant ]


... block building principle. | DIFFERENT PCBS | of the same materials and surface structure, but of varying amounts are combined to make up one | MULTILAYER BOARDS PLANT | production lot. Preparation costs incurred during the manufacturing process can therefore be shared between several units. We offer the same quality as a series production | MULTILAYER BOARDS PLANT | up to 1000 dm² PCBs size and pass the cost savings of the combined production on to you. Data preparation and technical support is, of | MULTILAYER BOARDS PLANT | course, included. | SELECTED CAPABILITIES: | Archiving Process Data Drill- / Milling Program Archiving Customer Data Production Data Conversion E-Test optional Design Check UL - | MULTILAYER BOARDS PLANT | Listing optional Design Adjustment Further Options | TECHNICAL SPECIFICATION: | Delivery: in Single Board Format as well as in Panelized Board Arrays and Sub-Arrays with | MULTILAYER BOARDS PLANT | / without Fixing Tabs finished by Milling and Scoring to size. M| ILLING-COORDINATES [-?-]: | One with Milled Outline. One MAA-Unit (MAA-U) is made up | MULTILAYER BOARDS PLANT | of 20 MAA´s Data-Base Format: Gerber, ODB++, DPF ...
[ Multilayer Boards Plant ]