Multilayer Boards Producer RAPID MASS PRODUCTION (RMP) is a new and unique express service for large and medium-sized series.

... long been an established surface refining process among printed circuit board techniques. However, in spite of many advantages over conventional solder levelling it has | MULTILAYER BOARDS PRODUCER | only been adopted for certain application areas. Nickel gold is utilized in particular where PCB surfaces are exposed to aggressive environments, for instance in mobile | MULTILAYER BOARDS PRODUCER | phones, or automobile electronics. Due to the consistent chemical precipitation of metal, gold is the obvious choice for all fine-pitch assemblings with under 0,5 mm | MULTILAYER BOARDS PRODUCER | grid spaces. Due to its smooth excellence, the immersion nickel gold surface is a better alternative to HAL, particularly for narrow SMD grids on both | MULTILAYER BOARDS PRODUCER | side of PCB`s. The actual wiring of a component is effected by means of a 4-6 my thick layer of nickel, and not by means | MULTILAYER BOARDS PRODUCER | of the extremely fine 0,05 to 0,2 my layer of gold which merely serves as an oxidation and diffusion blockage in order to extend the | MULTILAYER BOARDS PRODUCER | soldering conditions. Thicker gold layers, up to 0,3 my, are only targeted for ...
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... make the fabricator's life much simpler. Bear in mind that a | FABRICATOR'S | spacing tolerances likely differ from yours. For example, take the | MULTILAYER BOARDS PRODUCER | drill data. When laying out a board, you usually work with finished hole sizes. However, a fabricator must drill a hole larger than the finished | MULTILAYER BOARDS PRODUCER | one, about 0.004" to 0.005" over, then plate down to the desired finished size. This can lead to problems in maintaining annular ring requirements and | MULTILAYER BOARDS PRODUCER | copper spacing on internal layers. To meet manufacturing specs, the fabricator might have to modify the data, and that's the last thing you want. So | MULTILAYER BOARDS PRODUCER | now we have an alternate reality: You've finished the | PCB LAYOUT | (check out those negative planes!). You output the 274X and IPC-D-356 netlist | MULTILAYER BOARDS PRODUCER | files. The data are fed into a fab analysis tool and run through their paces. Clearances are good. No possible soldermask flaking. Spacing between the | MULTILAYER BOARDS PRODUCER | drills is just right. You hand the data set to the fabricator, and voila! No unexpected phone calls, no ...
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... how to determine the MAA. The multi-panel system (MP) is available up to max. 490mm x 290mm (including at least 5mm surrounds). a.) If | MULTILAYER BOARDS PRODUCER | you select “No Outline Routing” we deliver the MP without any outline routing of the individual boards. b.) If you select one of the “MAA-U” | MULTILAYER BOARDS PRODUCER | the outline of the individual boards are milled, whereby the individual PCBs are kept within the MP by milling fixing tabs of 1.5 mm. The | MULTILAYER BOARDS PRODUCER | PCBs must be at least 6,00 mm apart from each other. The boards are milled in accordance with the dimensionlayer, which must be a separate | MULTILAYER BOARDS PRODUCER | layer containing just the unbroken contour of the boards (edge markings or drawings are not suitable and result in additional charge). Program charges for milling | MULTILAYER BOARDS PRODUCER | angle alternations / milling dipping points (MAA) are calculated as follows: The total of the MAA is figured out by adding according to the exemplary | MULTILAYER BOARDS PRODUCER | drawing below One MAA Unit (MAA-U) is made up of 20 MAA. A maximum of 6 MAA-U may be used. | METHODS OF SHIPMENT | | MULTILAYER BOARDS PRODUCER | > Which ...
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