... Sound Excellent Copper-to-Copper Adhesion and Through-Hole Coverage Horizontal and Vertical Process Compatibility No Hole Size, MLB Layer Count or Aspect Ratio Limitations Suitable for | MULTILAYER BOARDS PRODUCTION | PTH Innerlayer or Microvia Metallization CHARACTERISTICS: - excellent copper to copper adhesion - no additional etching will be necessary for copper-cleaning - no residuals in | MULTILAYER BOARDS PRODUCTION | blind-micro-Via´s The DMS-E direct metallization system selectively deposits highly conductive polymer on dielectric resin and glass areas without the use of electroless copper. The formaldehyde-free, | MULTILAYER BOARDS PRODUCTION | environmentally sound technology provides fast and uniform coverage of the plated through-hole. DMS-E selective catalyzation ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. | MULTILAYER BOARDS PRODUCTION | Innerlayer and outerlayer copper surfaces remain pristine, eliminating the potential for interconnect defects and copper- to-copper adhesion failure. Costly waste treatment and microetch post-treatments are | MULTILAYER BOARDS PRODUCTION | not ...
[ Multilayer Boards Production ]


... | Part of the electromagnetic spectrum between the visible light range and the radar range. | INFRARED FUSING | The melting of tin / | MULTILAYER BOARDS PRODUCTION | lead plating on PCB's using the energy given off by infrared waves | INSULATION RESISTANCE | The electrical resistance of the insulating material between any | MULTILAYER BOARDS PRODUCTION | pair of contacts, conductors, or grounding devices in various combinations. | INSULATION METAL SUBSTRATES (IMS) |  Insulated metal substrates (IMS), thermal substrates, SMI or Alep | MULTILAYER BOARDS PRODUCTION | Twin - there are many names for special PCB´s that were developed for one main purpose: to draw the undesired heat from electric components off | MULTILAYER BOARDS PRODUCTION | the circuit board at a reasonable cost and, if possible, saving space. | INTERFACIAL CONNECTION | A conductor which connects conductive patterns on opposite sided | MULTILAYER BOARDS PRODUCTION | of a PCB or other base. | INTERNAL LAYER (INNERLAYER) | A conductive pattern contained entirely within a multilayer PCB | IMIDAZOL |Chemical compound of | MULTILAYER BOARDS PRODUCTION | the formula C5 N2 HR3., application as agent to passivate ...
[ Multilayer Boards Production ]


... to 274X. 274D is obsolete; the external aperture information is more cumbersome and difficult for fabricators to deal with because they have to worry | MULTILAYER BOARDS PRODUCTION | about translators and parsers to read the aperture table information. As a result, aperture data might be misinterpreted. Worse, someone might have typed in the | MULTILAYER BOARDS PRODUCTION | information manually - and erroneously. By contrast, in 274X, all the aperture information is contained within the Gerber file, which can be read by most | MULTILAYER BOARDS PRODUCTION | CAM tools automatically. For netlists, | IPC-D-356 | is the preferred format for fabrication. It's widely used by many of the bare-board test-fixturing machines and | MULTILAYER BOARDS PRODUCTION | is one of the only true ways to identify power- to-ground shorts. With the information in this format coming directly from the engineering CAD system, | MULTILAYER BOARDS PRODUCTION | there's no danger of the fabricator "reverse engineering" the netlist from the Gerber files. Next up are the internal | PLANE LAYERS |. For some | MULTILAYER BOARDS PRODUCTION | reason, CAD engineers like them to be "positive," but those types of ...
[ Multilayer Boards Production ]