... quality and registration of the images is of a standard that will enable a good quality board to be produced. Another important criteria is | MULTILAYER BOARDS PROTOTYPE | the presence of orientation marks within the boundary of board. These marks could be the board reference so long as it cannot be read from | MULTILAYER BOARDS PROTOTYPE | the other side. (This is for your protection to prevent the boards made inside out). Images should comply with design rules that will result in | MULTILAYER BOARDS PROTOTYPE | a board that will meet performance and cost requirements. - Scale must be given, tapes securely stuck to the backing sheet, track to pad & | MULTILAYER BOARDS PROTOTYPE | track to track joints complete and the backing sheet clean. - Scale must be given and be at least 2:1. Plots must also offer sharp | MULTILAYER BOARDS PROTOTYPE | edge definition and traces dense enough for blocking light when photographing. - Preferred on 7mil (178mm) thick base for stability. Films should be plotted on | MULTILAYER BOARDS PROTOTYPE | laser photoplotter or on vector photoplotter using a minimum resolution of ½mil (13mm). - Preferred in Gerber® format although accepted in ...
[ Multilayer Boards Prototype ]... provides front-end departments with a clear understanding of what's required to move a job to production. STANDARDIZED DRAWING NOTES Bottleneck: Incomplete or inconsistent notes | MULTILAYER BOARDS PROTOTYPE | on the fabrication drawing. Open Road: Fabrication drawings should include the board specification callout (or IPC-A-600); copper weight callout (1/2 oz., 1 oz., 2 oz., | MULTILAYER BOARDS PROTOTYPE | etc.); finish requirement (HASL, OSP, immersion gold, etc.); hole size tolerance; specify plated vs. non-plated holes; silkscreen color; board thickness and thickness tolerance; route tolerance; | MULTILAYER BOARDS PROTOTYPE | scoring specification; quality requirements such as cross section, ionic readings, certificate of compliance, impedance readings with coupons, solder sample, electrical test certificate, etc.; pack and | MULTILAYER BOARDS PROTOTYPE | ship instructions; and an impedance requirement that does not reflect line width or dielectric callout. NON-FUNCTIONAL LANDS Bottleneck: Non-functional lands for the CAM engineer and | MULTILAYER BOARDS PROTOTYPE | the manufacturing process engineer are a menace. Not only must the ...
[ Multilayer Boards Prototype ]... is to your requirements. - Always required even when a drill file is supplied, to enable inspection of panels immediately after drilling and finished | MULTILAYER BOARDS PROTOTYPE | boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not required unless different to our standard | MULTILAYER BOARDS PROTOTYPE | of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole | MULTILAYER BOARDS PROTOTYPE | is best). Tolerances are not required unless different to our standard of + / -0.25 mm. Other information required for all boards includes: board thickness | MULTILAYER BOARDS PROTOTYPE | (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour | MULTILAYER BOARDS PROTOTYPE | (std = white) bare board testing requirement (std for multilayer and fine line production runs) | EXTRA INFORMATION | required for multilayers includes: special dielectric | MULTILAYER BOARDS PROTOTYPE | spacing ...
[ Multilayer Boards Prototype ]