... | ELECTROLESS DEPOSITION | The deposition of conductive material from an autocatalytic plating solution without application of electrical current. | ELECTROPLATING | The electrodeposition | MULTILAYER BOARDS TECHNOLOGIES | of an adherent metal coating on a conductive object for protection, decoration, or other purposes. The object to be plated is placed in an electrolyte | MULTILAYER BOARDS TECHNOLOGIES | and connected to one terminal of a DC voltage source. The metal to be deposited is similarly immersed and connected to the other terminals. Ions | MULTILAYER BOARDS TECHNOLOGIES | of the metal provide transfer to metal as they make up the current flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been | MULTILAYER BOARDS TECHNOLOGIES | deposited onto the edges of the conductive pattern during drilling. Also called Resin Smear. | ETCH FACTOR | The ratio of the depth of etch | MULTILAYER BOARDS TECHNOLOGIES | (conductor thickness) to the amount of lateral etch (undercut). | ETCHBACK | The controlled removal of all components of base material by a chemical process | MULTILAYER BOARDS TECHNOLOGIES | on the sidewalls of plated through holes in order to expose | ETCHING | ...
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... The smear is the result of a hot drill melting the epoxy resin and spreading it across the hole wall during its up and | MULTILAYER BOARDS TECHNOLOGIES | down motion. The epoxy smear causes poor and in some cases non electrical continuity to the innerlayers as well as poor adhesion of the plated | MULTILAYER BOARDS TECHNOLOGIES | copper to the hole wall. In desmear, the chemical attack is designed to remove only the surface smear of resin from the hole wall, without | MULTILAYER BOARDS TECHNOLOGIES | attacking the wall structure itself. For most needs desmearing is sufficient whilst for some military applications it is necessary to etchback 75mm for what is | MULTILAYER BOARDS TECHNOLOGIES | referred to as 3 point contact. Etchback is a stronger chemical attack than desmearing. It is designed to remove not only the smeared resin, but | MULTILAYER BOARDS TECHNOLOGIES | also additional resin from the wall structure and the remaining protruding glass fibres. There are various methods of desmearing and etchback available to multilayer manufacturers. | MULTILAYER BOARDS TECHNOLOGIES | Permanganate works on the principle of oxidising the epoxy smear. Advantages are its predictability, its wide ...
[ Multilayer Boards Technologies ]


... such as cell phones, personal digital assistants, and notebook computers, the PCB industry is experiencing an overwhelming rise in demand for high-density interconnect structures | MULTILAYER BOARDS TECHNOLOGIES | (HDIS). The demand for HDIS translates directly into a vigorous market for the microvias used in many of these multilayer substrates as well as in | MULTILAYER BOARDS TECHNOLOGIES | conventional PCBs. In 1998, for example, the worldwide microvia market made up about four percent of the total multilayer PCB market. By 2007 that market | MULTILAYER BOARDS TECHNOLOGIES | share is expected to expand to nearly 30 percent Worldwide, | THE TOTAL MICROVIA MARKET | approached $4 billion in 2000 - up 63 percent | MULTILAYER BOARDS TECHNOLOGIES | over 1999 (Figure 2).1 By the end of 2001 the market should reach $5.6 billion - up another 50 percent over 2000. These same data | MULTILAYER BOARDS TECHNOLOGIES | show Japan as the microvia leader, followed by Europe, Asia, and North America. Several factors contribute to this remarkable expansion, the most important being the | MULTILAYER BOARDS TECHNOLOGIES | steadily increasing interconnect density of PCBs. Microvias have become an ...
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