... to remove any epoxy smeared onto the edge of the inner layer copper pads whilst drilling. The smear is the result of a hot | MULTILAYER CIRCUIT BOARD | drill melting the epoxy resin and spreading it across the hole wall during its up and down motion. The epoxy smear causes poor and in | MULTILAYER CIRCUIT BOARD | some cases non electrical continuity to the innerlayers as well as poor adhesion of the plated copper to the hole wall. In desmear, the chemical | MULTILAYER CIRCUIT BOARD | attack is designed to remove only the surface smear of resin from the hole wall, without attacking the wall structure itself. For most needs desmearing | MULTILAYER CIRCUIT BOARD | is sufficient whilst for some military applications it is necessary to etchback 75mm for what is referred to as 3 point contact. Etchback is a | MULTILAYER CIRCUIT BOARD | stronger chemical attack than desmearing. It is designed to remove not only the smeared resin, but also additional resin from the wall structure and the | MULTILAYER CIRCUIT BOARD | remaining protruding glass fibres. There are various methods of desmearing and etchback available to multilayer manufacturers. Permanganate works ...
[ Multilayer Circuit Board ]


... Passive Components | Impedance Control - In Fine-Line | Micro-Fine- Line | HDI-Technology | Forming Microvias in Laser- ITechnology - In Rapid Proto-Typing | | MULTILAYER CIRCUIT BOARD | In Medium to High Volume | In Rapid Mass-Production (high- Ispeed/high volume) - Specifications in DIN | in MIL | in IPC | In UL-Approval | MULTILAYER CIRCUIT BOARD | listed under File No.:96892 - In SMOBC Circuitry | Bare copper with LPI Solder Mask | OSP - Organic Surface IProtection - In HAL - | MULTILAYER CIRCUIT BOARD | Hot Air Leveling also RoHS- Compliant (Lead-free) - Gold Fingers-, Tabs-, or Body Plating | Nickel & Immersion Gold (NiPAu) | Immersion ITin Protection | | MULTILAYER CIRCUIT BOARD | Immersion Silver = Imm Ag | OSP (Organic Surface Protection) - Legend & Special Screen Printing | Carbon Ink | Peelable Ink - Profile in | MULTILAYER CIRCUIT BOARD | Routing | V-Scoring | Punching | Cutting | and Milling - With Electrical Testing | ESPECIALLY DURING THE LAST FEW YEARS | we succeeded in | MULTILAYER CIRCUIT BOARD | realizing new sophisticated concepts of automatisation, flexibility and other improvements in production techniques. Therefore we ...
[ Multilayer Circuit Board ]


... satisfactory adhesion of both plating and resist. OSP Organic Solderability Preservative (alternativ) This is a further alternative to the hot air levelled solder and | MULTILAYER CIRCUIT BOARD | electroless nickel / immersion gold finishes. It is an organic solderability preservative (OSP) and is normally applied after the screen printing and profiling stages of | MULTILAYER CIRCUIT BOARD | manufacture. Boards to be treated are chemically etched, cleaned and dried before being passed through a flood rinse module containing the OSP solution. This solution | MULTILAYER CIRCUIT BOARD | reacts chemically with the clean copper to form a thin layer of an organic complex some 0.3 microns thick. Results are monitored on a regular | MULTILAYER CIRCUIT BOARD | basis by coating test panels and assessing the thickness achieved by UV spectrometric means. Following treatment, the boards are rinsed to remove residues and dried | MULTILAYER CIRCUIT BOARD | to obtain a uniform film. Further drying completes the curing of the film, which then protects the underlying copper from environmental influences and subsequent multipass | MULTILAYER CIRCUIT BOARD | processing ...
[ Multilayer Circuit Board ]