... and the result is a final surface that can be stored and soldered. Completely level thanks to direct contact with the copper In fact, | MULTILAYER CIRCUIT BOARDS MANUFACTURING | such a thing does exist: a lead-free alternative to HAL (Hot Air Levelling) with these wonderful features, at least from the point of view of | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the PCB manufacturer. OSP is an organic solution based on an imidazole substitute which, by means of dipping or rinsing can be selectively applied to | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the copper surfaces, ready for soldering. A transparent layer, max. 0.2 to 0.6 my thick, covers the copper like a barely visible clear varnish. Purely | MULTILAYER CIRCUIT BOARDS MANUFACTURING | as a sealing agent, OSP offers good preconditions to adhere components that require an absolutely level surface, thanks to the fact that the soldering paste | MULTILAYER CIRCUIT BOARDS MANUFACTURING | is applied directly to the copper. The common problem of twisted fine-pitch components due to raised “tin bubbles” on the HAL surface is, therefore, a | MULTILAYER CIRCUIT BOARDS MANUFACTURING | thing of the past. The impress technique can be more precise with OSP, if one considers how much firmer ...
[ Multilayer Circuit Boards Manufacturing ]


... you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can be | MULTILAYER CIRCUIT BOARDS MANUFACTURING | supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard that will enable | MULTILAYER CIRCUIT BOARDS MANUFACTURING | a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could be | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made inside | MULTILAYER CIRCUIT BOARDS MANUFACTURING | out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. ARTWORKS Scale must be given, | MULTILAYER CIRCUIT BOARDS MANUFACTURING | tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. PENPLOTS Scale must be | MULTILAYER CIRCUIT BOARDS MANUFACTURING | given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light ...
[ Multilayer Circuit Boards Manufacturing ]


... 5 Conversion 5.1 We are not liable for errors occurring as a result of converting Eagle-BRD files into gerber data. 6 Annular Ring 6.1 | MULTILAYER CIRCUIT BOARDS MANUFACTURING | To guarantee an adequate annular ring encircling plated-through drills, the pad should have a surround of at least 300µ around the hole. 7 Pad 7.1 | MULTILAYER CIRCUIT BOARDS MANUFACTURING | If non-plated holes are positioned on one pad, the pad must have a surround of at least 500µ larger than the hole. Otherwise some/all of | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the pads may be removed. 8 Solder Resists 8.1 Please refrain from oversizing when drafting solder resists, i.e. the solder stop spaces are 1:1 to | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the pads. This facilitates the incorporation and required stretching of the solder resists during the manufacturing process. 9 Silkscreen 9.1 In order to perfectly reproduce | MULTILAYER CIRCUIT BOARDS MANUFACTURING | silkscreens, the type must be at least 1mm high and the stroke at least 200µ thick. Also, all surrounding solder areas must be clear of | MULTILAYER CIRCUIT BOARDS MANUFACTURING | component print for at least 250µ or imperfect print and printed solder areas may result. 10 Non-plated Holes 10.1 ...
[ Multilayer Circuit Boards Manufacturing ]