Multilayer Circuit Boards Plant Printed Circuit Boards (PCBs) range: HAL - Hot Air Leveling also RoHS-Compliant (Leadfree).

... question as to which surface protection is the right one. This is partly due to the changing technical demands on PCBs in further processing. | MULTILAYER CIRCUIT BOARDS PLANT | Also, as of 1. 6. 2006, EU-Regulations restricting the use of dangerous materials in electronic appliances are to include the prohibition of materials containing lead, | MULTILAYER CIRCUIT BOARDS PLANT | and is, therefore, another reason why alternative surfaces have been developed. One of these is immersion tin. PROCEDURE A layer of tin is applied to | MULTILAYER CIRCUIT BOARDS PLANT | the PCB by means of a special process, in which the copper atoms of the exposed conductors and contact areas are exchanged for tin atoms | MULTILAYER CIRCUIT BOARDS PLANT | by adding thiourea. The chemical reaction ends when the copper surface is 0,6 to 1,2 my. Between the tin and copper layers there is an | MULTILAYER CIRCUIT BOARDS PLANT | inter- metallic copper-tin phase after this process, i.e. blended metal. There are a number of reasons in favour of applying tin chemically. One advantage is | MULTILAYER CIRCUIT BOARDS PLANT | the uniform smoothness of the surface. This feature enables the application of fine pitch components ...
[ Multilayer Circuit Boards Plant ]


... AND REFINED: THE IMMERSION NICKEL GOLD PCBS APPLICATION AREAS Immersion nickel gold process has long been an established surface refining process among printed circuit | MULTILAYER CIRCUIT BOARDS PLANT | board techniques. However, in spite of many advantages over conventional solder levelling it has only been adopted for certain application areas. Nickel gold is utilized | MULTILAYER CIRCUIT BOARDS PLANT | in particular where PCB surfaces are exposed to aggressive environments, for instance in mobile phones, or automobile electronics. Due to the consistent chemical precipitation of | MULTILAYER CIRCUIT BOARDS PLANT | metal, gold is the obvious choice for all fine-pitch assemblings with under 0,5 mm grid spaces. Due to its smooth excellence, the immersion nickel gold | MULTILAYER CIRCUIT BOARDS PLANT | surface is a better alternative to HAL, particularly for narrow SMD grids on both side of PCB`s. The actual wiring of a component is effected | MULTILAYER CIRCUIT BOARDS PLANT | by means of a 4-6 my thick layer of nickel, and not by means of the extremely fine 0,05 to 0,2 my layer of gold | MULTILAYER CIRCUIT BOARDS PLANT | which merely serves as an oxidation and diffusion blockage in order to ...
[ Multilayer Circuit Boards Plant ]


... reduction Panel Plating a Flash of Copper The panels are online in a wet state transferred to our automatic electrolytic copper plating lines to | MULTILAYER CIRCUIT BOARDS PLANT | get a flasch of copper.. The panels are attached to plating racks. When the racks are moved to the loading station, the system computer instructs | MULTILAYER CIRCUIT BOARDS PLANT | the hoist to pick up the rack and begin the plating cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness | MULTILAYER CIRCUIT BOARDS PLANT | 12 microns is deposited on the surface of the panel and on the walls of the drilled holes. This is achieved by applying an electric | MULTILAYER CIRCUIT BOARDS PLANT | current to a cell comprising the panel (the cathode) and a set of copper bars (the anodes) suspended in a conducting medium (the electrolyte). A | MULTILAYER CIRCUIT BOARDS PLANT | plating history log is maintained on the shop floor control computer which assists the operator in making minor adjustments to the plating current. Finally, the | MULTILAYER CIRCUIT BOARDS PLANT | panels are rinsed and returned to the unload station. Sample measurements are made from each rack of panels to ...
[ Multilayer Circuit Boards Plant ]