... supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard that will | MULTILAYER CIRCUIT BOARDS PRODUCE | enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could | MULTILAYER CIRCUIT BOARDS PRODUCE | be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made | MULTILAYER CIRCUIT BOARDS PRODUCE | inside out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. - Scale must be | MULTILAYER CIRCUIT BOARDS PRODUCE | given, tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. - Scale must | MULTILAYER CIRCUIT BOARDS PRODUCE | be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light when photographing. - Preferred | MULTILAYER CIRCUIT BOARDS PRODUCE | on 7mil (178mm) thick base for stability. Films should be plotted on laser photoplotter or on vector photoplotter using a minimum ...
[ Multilayer Circuit Boards Produce ]


... take the drill data. When laying out a board, you usually work with finished hole sizes. However, a fabricator must drill a hole larger | MULTILAYER CIRCUIT BOARDS PRODUCE | than the finished one, about 0.004" to 0.005" over, then plate down to the desired finished size. This can lead to problems in maintaining annular | MULTILAYER CIRCUIT BOARDS PRODUCE | ring requirements and copper spacing on internal layers. To meet manufacturing specs, the fabricator might have to modify the data, and that's the last thing | MULTILAYER CIRCUIT BOARDS PRODUCE | you want. So now we have an alternate reality: You've finished the PCB layout (check out those negative planes!). You output the 274X and IPC-D-356 | MULTILAYER CIRCUIT BOARDS PRODUCE | netlist files. The data are fed into a fab analysis tool and run through their paces. Clearances are good. No possible soldermask flaking. Spacing between | MULTILAYER CIRCUIT BOARDS PRODUCE | the drills is just right. You hand the data set to the fabricator, and voila! No unexpected phone calls, no changes in the layout, and | MULTILAYER CIRCUIT BOARDS PRODUCE | the fabricator happily sends back a good set of boards on time. Our recommendations for the correct storage of ...
[ Multilayer Circuit Boards Produce ]


... or imperfect print and printed solder areas may result. 10 Non-plated Holes 10.1 This refers to plated through PCBs: If we do not have | MULTILAYER CIRCUIT BOARDS PRODUCE | any information from you as to which holes are to be plated-through and which are not, we will determine this to the best of our | MULTILAYER CIRCUIT BOARDS PRODUCE | knowledge. 11 Data Provided (Data Inconsistency) 11.1 If drilling and measurement plans are included that do not match the drilling program or the contour according | MULTILAYER CIRCUIT BOARDS PRODUCE | to the gerber-data, then the drilling program and the gerber-data will be binding in all cases. 12 PCB Contour 12.1 If not otherwise stipulated, the | MULTILAYER CIRCUIT BOARDS PRODUCE | PCB contour will be determined by the centre (=centre vector) of the contour lines provided in the order data. If Slots are represented by you | MULTILAYER CIRCUIT BOARDS PRODUCE | by rectangular outlines, then we assume generally that the corner radius is contained. 13 Technical Specifications 13.1 For further technical specifications of our manufacturing processes, | MULTILAYER CIRCUIT BOARDS PRODUCE | please refer to our „Process & Capability Manual“ in the "Standard" category. These ...
[ Multilayer Circuit Boards Produce ]