... IS OBVIOUS: Demands for quality controls mean additional production costs. In the common interest of customers and manufacturers, the question of optimal testing is | MULTILAYER CIRCUIT BOARDS PRODUCTION | repeatedly posed in the production process. The days of the first “printed circuits” which could be checked simply with the naked eye are over. Today, | MULTILAYER CIRCUIT BOARDS PRODUCTION | high-tech equipment is necessary for a thorough PCB test. Optical checks with the aid of conventional microscopic equipment are sufficient for one-sided and relatively simple | MULTILAYER CIRCUIT BOARDS PRODUCTION | double-sided PCBs. Residues, constricted conductors and sub-corrosions can be discovered which would otherwise lead to PCB failure after a number of operational hours. An electrical | MULTILAYER CIRCUIT BOARDS PRODUCTION | test is needed to check the actual functions of a PCB. It is an essential if inner layers need to be tested, as is the | MULTILAYER CIRCUIT BOARDS PRODUCTION | case with multi-layers. In two position measurements all connections in the PCB are checked for stoppages and short circuits . All SMD pads and plated | MULTILAYER CIRCUIT BOARDS PRODUCTION | through holes are checked. The electrical test can ...
[ Multilayer Circuit Boards Production ]


... / Benefits Selective to Dielectric and Glass Total Process Cost Reduction Environmentally Sound Excellent Copper-to-Copper Adhesion and Through-Hole Coverage Horizontal and Vertical Process Compatibility | MULTILAYER CIRCUIT BOARDS PRODUCTION | No Hole Size, MLB Layer Count or Aspect Ratio Limitations Suitable for PTH Innerlayer or Microvia Metallization The DMS-E direct metallization system selectively deposits highly | MULTILAYER CIRCUIT BOARDS PRODUCTION | conductive polymer on dielectric resin and glass areas without the use of electroless copper. The formaldehyde-free, environmentally sound technology provides fast and uniform coverage of | MULTILAYER CIRCUIT BOARDS PRODUCTION | the plated through-hole. DMS-E selective catalyzation ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. Innerlayer and outerlayer copper surfaces remain pristine, eliminating the | MULTILAYER CIRCUIT BOARDS PRODUCTION | potential for interconnect defects and copper- to-copper adhesion failure. Costly waste treatment and microetch post-treatments are not required. Fully compatible with most electrolytic acid coppers, ...
[ Multilayer Circuit Boards Production ]


... Breakthrough in Printed Circuit Board and Multilayer Boards Technology ! Krefeld- The drilling correction of the inner-layer alignment is still the greatest quality risk | MULTILAYER CIRCUIT BOARDS PRODUCTION | in the production of multi-layers. Until now, in order to maintain an acceptable reject rate, many extremely machine-intensive work steps have been necessary (e.g. the | MULTILAYER CIRCUIT BOARDS PRODUCTION | use of x-ray machines). Thanks to a revolutionary technique developed In cooperation with the Lenz Company and the Frauenhofer Institute, for which a patent has | MULTILAYER CIRCUIT BOARDS PRODUCTION | been applied, we have managed to eliminate the quality pifalls as well as to combine all of the work steps, from stock recognition to CNC | MULTILAYER CIRCUIT BOARDS PRODUCTION | drilling into one step. The advantages for cost and competiveness are immense ! The Problem Multi-layer pressing can only guarantee the best innerlayer adhesion if | MULTILAYER CIRCUIT BOARDS PRODUCTION | the fibre glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as a dielektric medium, gel. As a result of the high pressures | MULTILAYER CIRCUIT BOARDS PRODUCTION | (150 bar) and temperatures (175 C) ...
[ Multilayer Circuit Boards Production ]