... a guide to the preferred requirements for producing quality Printed Circuit Boards. Can be supplied as artworks, penplots, photoplots or photoplot files, so long | MULTILAYER CIRCUIT BOARDS PROTOTYPING | as the quality and registration of the images is of a standard that will enable a good quality board to be produced. Another important criteria | MULTILAYER CIRCUIT BOARDS PROTOTYPING | is the presence of orientation marks within the boundary of board. These marks could be the board reference so long as it cannot be read | MULTILAYER CIRCUIT BOARDS PROTOTYPING | from the other side. (This is for your protection to prevent the boards made inside out). Images should comply with design rules that will result | MULTILAYER CIRCUIT BOARDS PROTOTYPING | in a board that will meet performance and cost requirements. - Scale must be given, tapes securely stuck to the backing sheet, track to pad | MULTILAYER CIRCUIT BOARDS PROTOTYPING | & track to track joints complete and the backing sheet clean. - Scale must be given and be at least 2:1. Plots must also offer | MULTILAYER CIRCUIT BOARDS PROTOTYPING | sharp edge definition and traces dense enough for blocking light when photographing. - Preferred on 7mil (178mm) thick base for stability. ...
[ Multilayer Circuit Boards Prototyping ]


... format for fabrication. It's widely used by many of the bare-board test-fixturing machines and is one of the only true ways to identify power- | MULTILAYER CIRCUIT BOARDS PROTOTYPING | to-ground shorts. With the information in this format coming directly from the engineering CAD system, there's no danger of the fabricator "reverse engineering" the netlist | MULTILAYER CIRCUIT BOARDS PROTOTYPING | from the Gerber files. Next up are the internal plane layers. For some reason, CAD engineers like them to be "positive," but those types of | MULTILAYER CIRCUIT BOARDS PROTOTYPING | layers lead to huge file sizes. Negative plane layers are usually preferred by fabricators because they're easier to work with and have smaller file sizes | MULTILAYER CIRCUIT BOARDS PROTOTYPING | than positive layers. Remember, boards are manufactured en masse and must be stepped out into a panelized form. The result: Data sets with lots of | MULTILAYER CIRCUIT BOARDS PROTOTYPING | unnecessary positive planes swell exponentially, bog down CAM systems, and crash photoplotters. After the basic prep work is completed, step into the fabrication analysis arena, | MULTILAYER CIRCUIT BOARDS PROTOTYPING | where the game is one of checks and balances. ...
[ Multilayer Circuit Boards Prototyping ]


... information is more cumbersome and difficult for fabricators to deal with because they have to worry about translators and parsers to read the aperture | MULTILAYER CIRCUIT BOARDS PROTOTYPING | table information. As a result, aperture data might be misinterpreted. Worse, someone might have typed in the information manually - and erroneously. By contrast, in | MULTILAYER CIRCUIT BOARDS PROTOTYPING | 274X, all the aperture information is contained within the Gerber file, which can be read by most CAM tools automatically. For netlists, IPC-D-356 is the | MULTILAYER CIRCUIT BOARDS PROTOTYPING | preferred format for fabrication. It's widely used by many of the bare-board test-fixturing machines and is one of the only true ways to identify power- | MULTILAYER CIRCUIT BOARDS PROTOTYPING | to-ground shorts. With the information in this format coming directly from the engineering CAD system, there's no danger of the fabricator "reverse engineering" the netlist | MULTILAYER CIRCUIT BOARDS PROTOTYPING | from the Gerber files. Next up are the internal plane layers. For some reason, CAD engineers like them to be "positive," but those types of | MULTILAYER CIRCUIT BOARDS PROTOTYPING | layers lead to huge file sizes. Negative plane layers ...
[ Multilayer Circuit Boards Prototyping ]