... staff intensive attention as the chemical baths call for a great deal of analysis and supervision due to the narrow processing slit. The process | MULTILAYER CIRCUIT BOARDS SUPPLIERS | of solder mask coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match the gold plating. To prevent the risk of poor | MULTILAYER CIRCUIT BOARDS SUPPLIERS | metallic deposition on the gold surface, vias must be completely free of solder mask coating or be completely closed by means of a special filling | MULTILAYER CIRCUIT BOARDS SUPPLIERS | process. Curing of the solder mask coating must also concur with that of the chemical gold plating as it is exposed to hydrogen in the | MULTILAYER CIRCUIT BOARDS SUPPLIERS | 90° C nickel baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, in turn, also calls for further | MULTILAYER CIRCUIT BOARDS SUPPLIERS | investment in facilities. THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel gold coating, the results of | MULTILAYER CIRCUIT BOARDS SUPPLIERS | wave soldering are equally good to solder levelling. Good storage ability is also ...
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... SILVER = IMM AG) | Lead-Free PCB´s -The Surface of the Future ! Since July 1st, lead soldering is no longer permitted, and the | MULTILAYER CIRCUIT BOARDS SUPPLIERS | use of alternative surface refinements for pcb´s has so far provided unsatisfactory results, meaning that the lead-free problem has yet to be resolved. The chemical | MULTILAYER CIRCUIT BOARDS SUPPLIERS | nickel-gold procedure (Imm NiAu) was unsuccessful due to high costs, as was chemical tin. Both procedures have proven to be very complicated and sensitive in | MULTILAYER CIRCUIT BOARDS SUPPLIERS | the further course of processing management. Lead-free solderings also have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher processing temperatures and | MULTILAYER CIRCUIT BOARDS SUPPLIERS | copper leaching effects. We would briefly like to explain why we believe chemical silver is the lead-free procedure of the future, and why it will | MULTILAYER CIRCUIT BOARDS SUPPLIERS | be the focus of our future investments in the field of surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, it is a | MULTILAYER CIRCUIT BOARDS SUPPLIERS | non-electrical, auto-catalytic procedure based on ...
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... The time, expressed in seconds, required for a resin to change from a solid to a liquid and back to a solid again, due | MULTILAYER CIRCUIT BOARDS SUPPLIERS | to the action of thermal input. | GLASS EPOXY |A material used to fabricate Printed Circuit Boards. The base material (fiberglass) is impregnated with epoxy | MULTILAYER CIRCUIT BOARDS SUPPLIERS | filler which then must have copper laminated to its outer surface to form the material required to manufacture Printed Circuit Boards. | GOLDEN BOARD | | MULTILAYER CIRCUIT BOARDS SUPPLIERS | A PCB previously found to be correct, used as a reference in comparative testing methods. | GRID A TWO-DIMENSIONAL | network consisting of a set | MULTILAYER CIRCUIT BOARDS SUPPLIERS | of equally spaced parallel lines superimposed upon another set of equally spaced parallel lines so that the lines of one set are perpendicular to the | MULTILAYER CIRCUIT BOARDS SUPPLIERS | lines of the other. | GROUND PLANE | A conducting surface, used as a common reference point for circuit returns shielding or heat ...
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