Multilayer Circuits Fab As in times of radical cuts in the "time-to-market" cyclus, our high-speed/high volume production enables you to be one step ahead in your product launch. Moreover excellent preparation at the artwork phasis shall guarantee that your choice of us is a great advantage in times of ruthless competition.

... gold process has long been an established surface refining process among printed circuit board techniques. However, in spite of many advantages over conventional solder | MULTILAYER CIRCUITS FAB | levelling it has only been adopted for certain application areas. Nickel gold is utilized in particular where PCB surfaces are exposed to aggressive environments, for | MULTILAYER CIRCUITS FAB | instance in mobile phones, or automobile electronics. Due to the consistent chemical precipitation of metal, gold is the obvious choice for all fine-pitch assemblings with | MULTILAYER CIRCUITS FAB | under 0,5 mm grid spaces. Due to its smooth excellence, the immersion nickel gold surface is a better alternative to HAL, particularly for narrow SMD | MULTILAYER CIRCUITS FAB | grids on both side of PCB`s. The actual wiring of a component is effected by means of a 4-6 my thick layer of nickel, and | MULTILAYER CIRCUITS FAB | not by means of the extremely fine 0,05 to 0,2 my layer of gold which merely serves as an oxidation and diffusion blockage in order | MULTILAYER CIRCUITS FAB | to extend the soldering conditions. Thicker gold layers, up to 0,3 my, are only ...
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... metal deposition on an unclad substrate with electroplating or with etching, or with both | SMOBC SOLDER MASK OVER BARE COPPER. | A method | MULTILAYER CIRCUITS FAB | of fabricating a printed wiring board which results in the final metallization being copper with no other protective metal but the non soldered areas are | MULTILAYER CIRCUITS FAB | coated by a solder resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing them | MULTILAYER CIRCUITS FAB | to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a liquid | MULTILAYER CIRCUITS FAB | (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 F | MULTILAYER CIRCUITS FAB | liquid to cool it and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and surface | MULTILAYER CIRCUITS FAB | insulate those areas of a circuit where soldering is not desired. | STEP AND REPEAT | A method by which successive exposures of a ...
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... by covering the pad and smd sides with gold. In our opinion, however, immersion nickel / gold will never become an established alternative to | MULTILAYER CIRCUITS FAB | HAL. As already mentioned, the processing costs are the greatest handicap for this method. However, due to the lack of other alternatives in the lead-free | MULTILAYER CIRCUITS FAB | future immersion nickel / gold will retain its position in the area of fine pitch and COB applications. Cost disadvantages of the immersion nickel / | MULTILAYER CIRCUITS FAB | gold process could be balanced, in particular in the production of large series (consumer goods), if the use of chip-on-board is considered. It is often | MULTILAYER CIRCUITS FAB | worth purchasing “bare” chips and connecting them directly to the PCB with bonding wire. The amount saved on the chip casing could then pay off. | MULTILAYER CIRCUITS FAB | | ERROR HIGHLIGHTS | > What are the most frequent mistakes or omissions? From the view of a pcb-manufacturer? (in order of the frequency) 1.) | MULTILAYER CIRCUITS FAB | The indication, which drillings or milling should be plated through or not plated through. 2.) The ...
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