... subjected to the hardest tests in the UL laboratories and they existed even the extremely heavy 130 C° long term test. That qualifies us | MULTILAYER CIRCUITS MANUFACTURING | without reservation for the US-American and Canadian safety standards. Down you see our "Yellow Card" shown with the valid parameters for a UL marking.     A | MULTILAYER CIRCUITS MANUFACTURING | (black triangle ) Symbol is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level requirements | MULTILAYER CIRCUITS MANUFACTURING | of UL 796. "All" is used to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level | MULTILAYER CIRCUITS MANUFACTURING | requirements of UL 796     For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. Explanations concerning the UL | MULTILAYER CIRCUITS MANUFACTURING | certification Clad Cond Width Min The minimum conductor width is 150 µm, except the distance of the track to the outer contour is smaller than | MULTILAYER CIRCUITS MANUFACTURING | 400 µm. Clad Cond Width Min Edge If the ...
[ Multilayer Circuits Manufacturing ]


... These Recognitions A (black triangle ) Symbol is marked on those products within a given type designation that comply with direct support of current-carrying | MULTILAYER CIRCUITS MANUFACTURING | parts performance level require-ments of UL 796. "All" is used to indicate that all base materials under that type designation comply with direct support of | MULTILAYER CIRCUITS MANUFACTURING | current-carrying parts performance level requirements of UL 796. For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. | MULTILAYER CIRCUITS MANUFACTURING | Explanations concerning the UL certification Clad Cond Width Min The minimum conductor width is 150 µm, except the distance of the track to the outer | MULTILAYER CIRCUITS MANUFACTURING | contour is smaller than 400 µm. Clad Cond Width Min Edge If the distance between the track and the outer contour is smaller than 400 | MULTILAYER CIRCUITS MANUFACTURING | µm, then the track must have a minimum width of 254 µm. Thk Minimum copper-thickness on the external layers is 17 µm Max Area Diam | MULTILAYER CIRCUITS MANUFACTURING | In no place of a copper surface may a circle with a diameter larger than 50,80 mm be ...
[ Multilayer Circuits Manufacturing ]


... | GERBER DATA |, switch to 274X. 274D is obsolete; the external aperture information is more cumbersome and difficult for fabricators to deal with | MULTILAYER CIRCUITS MANUFACTURING | because they have to worry about translators and parsers to read the aperture table information. As a result, aperture data might be misinterpreted. Worse, someone | MULTILAYER CIRCUITS MANUFACTURING | might have typed in the information manually - and erroneously. By contrast, in 274X, all the aperture information is contained within the Gerber file, which | MULTILAYER CIRCUITS MANUFACTURING | can be read by most CAM tools automatically. For netlists, | IPC-D-356 | is the preferred format for fabrication. It's widely used by many of | MULTILAYER CIRCUITS MANUFACTURING | the bare-board test-fixturing machines and is one of the only true ways to identify power- to-ground shorts. With the information in this format coming directly | MULTILAYER CIRCUITS MANUFACTURING | from the engineering CAD system, there's no danger of the fabricator "reverse engineering" the netlist from the Gerber files. Next up are the internal | | MULTILAYER CIRCUITS MANUFACTURING | PLANE LAYERS |. For some reason, CAD engineers like them to be ...
[ Multilayer Circuits Manufacturing ]