... withstand before breakdown occurs. | DIGITAL CIRCUIT | A circuit comprised of mostly integrated circuits which operates like a switch(i.e., it is either "ON" | MULTILAYER CIRCUITS ONLINE | or "OFF"). | DIGITIZING | The process of reducing feature locations on a flat plane to digital representation of X-Y coordinates. | DIMENSIONAL HOLE | | MULTILAYER CIRCUITS ONLINE | A hole in a printed board where the means of determining location is by coordinate values not necessarily coinciding with the stated grid. | DIMENSIONAL | MULTILAYER CIRCUITS ONLINE | STABILITY | A freedom from distortion caused by such factors as temperature, humidity, chemical treatment, age, or stress. | DIP SOLDERING | A process whereby | MULTILAYER CIRCUITS ONLINE | printed boards are brought in contact with the surface of a static pool of molten solder for the purpose of soldering the entire exposed conductive | MULTILAYER CIRCUITS ONLINE | pattern in one operation. | DISCRETE COMPONENT | A component which has been fabricated prior to its installation (i.e., resistors,capacitors, diodes and transistors) | DRY | MULTILAYER CIRCUITS ONLINE | FILM RESISTS COATING MATERIALS | specifically designed ...
[ Multilayer Circuits Online ]... Gehäuse / Modul zu ermöglichen. | PRECIOUS-METAL | One of the relatively scarce and valuable metals: gold, silver, and the platinum group metals. Edelmetalle | MULTILAYER CIRCUITS ONLINE | Wertvolle und in verhältnismäßig geringen Mengen vorkommende Metalle wie Gold, Silber und Platin, die eine eigene Gruppe im Periodensystem bilden. | PREPREG SHEET | material | MULTILAYER CIRCUITS ONLINE | consisting of the base material impregnated with a synthetic resin such as epoxy or polyimide, partially cured to the B-stage. They are molded under heat | MULTILAYER CIRCUITS ONLINE | and pressure for multilayer printed circuitry and are used for bonding together the individual circuit layers of multilayer PCB's. Prepreg Verbundfolie, Klebefolie, vorgehärtete Klebetafel. Prepregs | MULTILAYER CIRCUITS ONLINE | sind harzimprägnierte Glasgewebe, bei denen das Harz teilausgehärtet (teilpolymerisiert = B-Stage). Diese Vorpolymerisierung ist gerade so hoch, daß die Prepregs bei Berührung nicht kleben, jedoch | MULTILAYER CIRCUITS ONLINE | das Harz bei höherer Temperatur und Druck wieder schmilzt und wieder aushärtet. In der Leiterplattenherstellung ...
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