... Points: These MAA are not necessary for a standard board outline. If many mechanical configurations are to be routed, please look at the example | MULTILAYER CIRCUITS PRODUCE | how to determine the MAA. The multi-panel system (MP) is available up to max. 490mm x 290mm (including at least 5mm surrounds). a.) If you | MULTILAYER CIRCUITS PRODUCE | select “No Outline Routing” we deliver the MP without any outline routing of the individual boards. b.) If you select one of the “MAA-U” the | MULTILAYER CIRCUITS PRODUCE | outline of the individual boards are milled, whereby the individual PCBs are kept within the MP by milling fixing tabs of 1.5 mm. The PCBs | MULTILAYER CIRCUITS PRODUCE | must be at least 6,00 mm apart from each other. The boards are milled in accordance with the dimensionlayer, which must be a separate layer | MULTILAYER CIRCUITS PRODUCE | containing just the unbroken contour of the boards (edge markings or drawings are not suitable and result in additional charge). Program charges for milling angle | MULTILAYER CIRCUITS PRODUCE | alternations / milling dipping points (MAA) are calculated as follows: The total of the MAA is figured out by adding ...
[ Multilayer Circuits Produce ]


... comparison with a relay race also helps to recognise the solution to the problem. In analysing the BATON HANDOVER one realizes that this is | MULTILAYER CIRCUITS PRODUCE | something which is never influenced by an external trainer, but that the athlete alone must deal with this critical moment. The receiving athlete, in particular, | MULTILAYER CIRCUITS PRODUCE | must adapt with lightening speed to conditions that are never the same, i.e. to the speed, rhythm and movements of the previous runner, as well | MULTILAYER CIRCUITS PRODUCE | as to the positions of his opponents. This situation is therefore solved de-centrally, at the place of action. This is exactly the principle that we | MULTILAYER CIRCUITS PRODUCE | have adopted in our production. Although logistics and distribution still determine when an order must be completed, it is the operators in the departments themselves | MULTILAYER CIRCUITS PRODUCE | who are responsible for the regulation of a smooth flow of production. From the first production step, the respective operators promise to complete all RMP | MULTILAYER CIRCUITS PRODUCE | orders by a certain date. In this way the operator responsible for the ...
[ Multilayer Circuits Produce ]


... PCBs often leads to the question as to which surface protection is the right one. This is partly due to the changing technical demands | MULTILAYER CIRCUITS PRODUCE | on PCBs in further processing. Also, as of 1. 6. 2006, EU-Regulations restricting the use of dangerous materials in electronic appliances are to include the | MULTILAYER CIRCUITS PRODUCE | prohibition of materials containing lead, and is, therefore, another reason why alternative surfaces have been developed. One of these is immersion tin. PROCEDURE A layer | MULTILAYER CIRCUITS PRODUCE | of tin is applied to the PCB by means of a special process, in which the copper atoms of the exposed conductors and contact areas | MULTILAYER CIRCUITS PRODUCE | are exchanged for tin atoms by adding thiourea. The chemical reaction ends when the copper surface is 0,6 to 1,2 my. Between the tin and | MULTILAYER CIRCUITS PRODUCE | copper layers there is an inter- metallic copper-tin phase after this process, i.e. blended metal. There are a number of reasons in favour of applying | MULTILAYER CIRCUITS PRODUCE | tin chemically. One advantage is the uniform smoothness of the surface. This feature enables the application of ...
[ Multilayer Circuits Produce ]