... are less than 0.003", it's better to construct a mask opening over the entire group. That will make the fabricator's life much simpler. Bear | MULTILAYER CIRCUITS PRODUCER | in mind that a fabricator's spacing tolerances likely differ from yours. For example, take the drill data. When laying out a board, you usually work | MULTILAYER CIRCUITS PRODUCER | with finished hole sizes. However, a fabricator must drill a hole larger than the finished one, about 0.004" to 0.005" over, then plate down to | MULTILAYER CIRCUITS PRODUCER | the desired finished size. This can lead to problems in maintaining annular ring requirements and copper spacing on internal layers. To meet manufacturing specs, the | MULTILAYER CIRCUITS PRODUCER | fabricator might have to modify the data, and that's the last thing you want. So now we have an alternate reality: You've finished the PCB | MULTILAYER CIRCUITS PRODUCER | layout (check out those negative planes!). You output the 274X and IPC-D-356 netlist files. The data are fed into a fab analysis tool and run | MULTILAYER CIRCUITS PRODUCER | through their paces. Clearances are good. No possible soldermask flaking. Spacing between the drills is just ...
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... be regarded rather as unwanted function loss, which have to avoid or to limit. | IN ORDER TO ACHIEVE THIS GOAL |, not only | MULTILAYER CIRCUITS PRODUCER | the control of the own production processes is necessary, also as a starting point of the manufacturing is the procurement of qualitatively perfect products of | MULTILAYER CIRCUITS PRODUCER | our suppliers. Therefore obligate our suppliers to be able to manufacture in application of our consistent quality philosophy and in definition of methodology and realization | MULTILAYER CIRCUITS PRODUCER | provably the correct quality. For this among other things counts the obligation of our suppliers to attach to each supply a test certificate. This demand | MULTILAYER CIRCUITS PRODUCER | is a component of our quality management system and we evaluate and control it continuously with an evaluation procedure. Beyond that the examinations are regulated | MULTILAYER CIRCUITS PRODUCER | in our house by employment regulations in the inspection of incoming goods. - In the case of | EACH INCOMING ORDER | we examine first | MULTILAYER CIRCUITS PRODUCER | the contract and the reproductibility. Hereby the complete manufacturing process is ...
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... loaded on to an accumulator for cool down and availability to the imaging operation. Image LPI Mask Dried solder mask is imaged in a | MULTILAYER CIRCUITS PRODUCER | manner similar to that used for imaging the circuitry. Phototools containing black areas where the solder mask is to be removed are placed in direct | MULTILAYER CIRCUITS PRODUCER | contact with both sides of the panel. The panel is then exposed to UV light. The amount of light used is controlled by an integrator. | MULTILAYER CIRCUITS PRODUCER | Printing is done with a semi-automatic dual drawer printer. While one drawer is being loaded with a panel and phototools, the other is inside the | MULTILAYER CIRCUITS PRODUCER | machine being exposed. This dual drawer printing system runs at the same rate as the screen printer to insure continuous flow. Develop LPI Mask After | MULTILAYER CIRCUITS PRODUCER | the panel has been exposed, it is placed in a vertical developer. The unexposed solder mask is dissolved in a high pressure spray of developing | MULTILAYER CIRCUITS PRODUCER | solution. The solution temperature, concentration and conveyor speed control the development process. The developer solution concentration ...
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