... OF PRINTED CIRCUIT BOARDS | | EDGE SPACING | The distance of a pattern, components, or both, from the edges of the printed board. | MULTILAYER CIRCUITS PROTOTYPE | | EDGE-BOARD CONTACT | A series of contact printed on or near any edge of a PCB and intended for mating with an edge connector. | MULTILAYER CIRCUITS PROTOTYPE | | ELECTROLESS DEPOSITION | The deposition of conductive material from an autocatalytic plating solution without application of electrical current. | ELECTROPLATING | The electrodeposition of | MULTILAYER CIRCUITS PROTOTYPE | an adherent metal coating on a conductive object for protection, decoration, or other purposes. The object to be plated is placed in an electrolyte and | MULTILAYER CIRCUITS PROTOTYPE | connected to one terminal of a DC voltage source. The metal to be deposited is similarly immersed and connected to the other terminals. Ions of | MULTILAYER CIRCUITS PROTOTYPE | the metal provide transfer to metal as they make up the current flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been deposited | MULTILAYER CIRCUITS PROTOTYPE | onto the edges of the conductive pattern during drilling. Also called Resin Smear. | ETCH FACTOR | The ...
[ Multilayer Circuits Prototype ]


... conditions. Production-proven in both vertical and horizontal process equipment, the versatile system yields total process cost reduction Panel Plating a Flash of Copper The | MULTILAYER CIRCUITS PROTOTYPE | panels are online in a wet state transferred to our automatic electrolytic copper plating lines to get a flasch of copper.. The panels are attached | MULTILAYER CIRCUITS PROTOTYPE | to plating racks. When the racks are moved to the loading station, the system computer instructs the hoist to pick up the rack and begin | MULTILAYER CIRCUITS PROTOTYPE | the plating cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness 12 microns is deposited on the surface of the | MULTILAYER CIRCUITS PROTOTYPE | panel and on the walls of the drilled holes. This is achieved by applying an electric current to a cell comprising the panel (the cathode) | MULTILAYER CIRCUITS PROTOTYPE | and a set of copper bars (the anodes) suspended in a conducting medium (the electrolyte). A plating history log is maintained on the shop floor | MULTILAYER CIRCUITS PROTOTYPE | control computer which assists the operator in making minor adjustments to the plating ...
[ Multilayer Circuits Prototype ]


... The answer to the lead-free problem could sound this simple: Immerse a printed circuit board into a solution, and the result is a final | MULTILAYER CIRCUITS PROTOTYPE | surface that can be stored and soldered. In fact, such a thing does exist: a lead-free alternative to HAL (Hot Air Levelling) with these wonderful | MULTILAYER CIRCUITS PROTOTYPE | features, at least from the point of view of the PCB manufacturer. OSP is an organic solution based on an imidazole substitute which, by means | MULTILAYER CIRCUITS PROTOTYPE | of dipping or rinsing can be selectively applied to the copper surfaces, ready for soldering. A transparent layer, max. 0.2 to 0.6 my thick, covers | MULTILAYER CIRCUITS PROTOTYPE | the copper like a barely visible clear varnish. COMPLETELY LEVEL THANKS TO DIRECT CONTACT WITH THE COPPER Purely as a sealing agent, OSP offers good | MULTILAYER CIRCUITS PROTOTYPE | preconditions to adhere components that require an absolutely level surface, thanks to the fact that the soldering paste is applied directly to the copper. The | MULTILAYER CIRCUITS PROTOTYPE | common problem of twisted fine-pitch components due to raised “tin bubbles” on the HAL surface is, therefore, a ...
[ Multilayer Circuits Prototype ]