... to ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, to enable inspection of | MULTILAYER CIRCUITS PROTOTYPING | panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not | MULTILAYER CIRCUITS PROTOTYPING | required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and slots. Also preferred is | MULTILAYER CIRCUITS PROTOTYPING | a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / -0.25 mm. Other information required | MULTILAYER CIRCUITS PROTOTYPING | for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type (std | MULTILAYER CIRCUITS PROTOTYPING | = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production runs) Extra information required for | MULTILAYER CIRCUITS PROTOTYPING | multilayers includes: ...
[ Multilayer Circuits Prototyping ]


... Images To help you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit | MULTILAYER CIRCUITS PROTOTYPING | Boards. Can be supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard | MULTILAYER CIRCUITS PROTOTYPING | that will enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These | MULTILAYER CIRCUITS PROTOTYPING | marks could be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the | MULTILAYER CIRCUITS PROTOTYPING | boards made inside out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. - Scale | MULTILAYER CIRCUITS PROTOTYPING | must be given, tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. - | MULTILAYER CIRCUITS PROTOTYPING | Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking ...
[ Multilayer Circuits Prototyping ]


... TERMS OF PRINTED CIRCUIT BOARDS | | LAND | A portion of a conductive pattern usually, but not exclusively, used for the connection and | MULTILAYER CIRCUITS PROTOTYPING | / or attachment of components. Also called Pad, Boss, Terminal Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole without a land(s). | MULTILAYER CIRCUITS PROTOTYPING | | LASER VIAS | Are partial vias which are produced by a laser. They may connect two adjacent layers. Through-vias cannot be produced with this | MULTILAYER CIRCUITS PROTOTYPING | technique. | LAYER-TO-LAYER SPACING | The thickness of dielectric material between adjacent layers of conductive circuitry. | LAY-UP | The technique of registering and stacking | MULTILAYER CIRCUITS PROTOTYPING | layers of a multilayer board before the laminating cycle. | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, curtain coating, or | MULTILAYER CIRCUITS PROTOTYPING | spraying. Afterwards, the laquer is cured sufficiently for the solder mask pattern to be photo-transferred to it before the unexposed parts are removed through a | MULTILAYER CIRCUITS PROTOTYPING | developing ...
[ Multilayer Circuits Prototyping ]