... thanks to the thinness of the layer. The thin tin layer does, however, has its disadvantages. The inter-metallic copper-tin phase is approx. 0,25 mµ | MULTILAYER CIRCUITS SERVICES | thick when delivered. During storage, the diffusion of copper in the tin surface continues, causing the thickness of the pure copper or tin layers to | MULTILAYER CIRCUITS SERVICES | decrease. If the blended metal reaches the surface it becomes coated with a non- removable oxide, making soldering impossible. Storage possibilities of immersion tin PCBs | MULTILAYER CIRCUITS SERVICES | are, for this reason, considerably limited compared with conventional SnPb techniques: stored PCBs should be used up within 3 months and if time exceeds 6 | MULTILAYER CIRCUITS SERVICES | months, heavy processing problems can occur. The price of immersion tin is between that of the classical SnPb and the immersion nickel gold surfaces. However, | MULTILAYER CIRCUITS SERVICES | thiourea, which is used in the production, does not conform with environmental or effluent requirements, therefore the future costs for disposing of wastes are difficult | MULTILAYER CIRCUITS SERVICES | to calculate, particularly in view ...
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... profile of the individual PCB; there are no cross-subsidy and no lump sums. You pay only for the achievement, which must be actually furnished | MULTILAYER CIRCUITS SERVICES | for the production of your product. Our proven mass-production-express service (Rapid-Mass-Production) is offered also in this line | SELECTED CAPABILITIES: | Archiving Process Data Drill- | MULTILAYER CIRCUITS SERVICES | / Milling Program Archiving Customer Data Production Data Conversion E-Test optional Design Check UL - approval Design Adjustment Further Options | TECHNICAL SPECIFICATION: DELIVERY: | | MULTILAYER CIRCUITS SERVICES | In Single Board Format as well as in Panelized Board Arrays and Sub-Arrays with / without Fixing Tabs finished by Milling, Punching and Scoring to | MULTILAYER CIRCUITS SERVICES | size. | DATA-BASE FORMAT: | Gerber, ODB++, DPF Type of the Base Material: FR 4 and Special-Material Layers: Up to 24 Surface Protection: See List | MULTILAYER CIRCUITS SERVICES | of Surfaces [- ?-] Layer Build-Up: Arbitrary Electrical Testing: Flying Probe or Adaptor Final Thickness of PCB: 0,5 mm to 3,20 mm Junction in Line-Production: | MULTILAYER CIRCUITS SERVICES | Yes Min. Track ...
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... lead to the misplacement of the draw, crash the rastorization software, and crash the photoplotter. Conversion issues: Error in the conversion from draw to | MULTILAYER CIRCUITS SERVICES | flash. This can happen when a land that is chosen for conversion has an extra length of vector to it, and the CAM software converts | MULTILAYER CIRCUITS SERVICES | the others that are similar to it into the same flash land. It can convert lands designed to be a bit larger (0.002" to 0.003") | MULTILAYER CIRCUITS SERVICES | and also convert them to a smaller size. (a) Allowing the operator and CAM software to convert lands could lead to errors in the design | MULTILAYER CIRCUITS SERVICES | and, later, undesirable output. (b) Unintentional swaping of X and Y locations. (c) Offset or shift of original placement due to the software errors with | MULTILAYER CIRCUITS SERVICES | the datum for the feature. * Conversion of draws is also necessary if the Gerber files used to plot the artwork are used to generate | MULTILAYER CIRCUITS SERVICES | an electrical test netlist and fixturing files. All fixturing software must convert lands in order to produce a dependable netlist, that is, one that will ...
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