Multilayer Circuits Technologies Double-sided or plated thru hole Printed Circuit Board (PCB): 608 x 508 mm.

... of x-ray machines). Thanks to a revolutionary technique developed In cooperation with the Lenz Company and the Frauenhofer Institute, for which a patent has | MULTILAYER CIRCUITS TECHNOLOGIES | been applied, we have managed to eliminate the quality pifalls as well as to combine all of the work steps, from stock recognition to CNC | MULTILAYER CIRCUITS TECHNOLOGIES | drilling into one step. The advantages for cost and competiveness are immense ! The Problem Multi-layer pressing can only guarantee the best innerlayer adhesion if | MULTILAYER CIRCUITS TECHNOLOGIES | the fibre glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as a dielektric medium, gel. As a result of the high pressures | MULTILAYER CIRCUITS TECHNOLOGIES | (150 bar) and temperatures (175 C) applied the resin becomes so fluid that the inner-layers actually swim and expand due to the heat. This can result | MULTILAYER CIRCUITS TECHNOLOGIES | in undefined dimension instabilities as well as inner-layer alignment. It is extremely difficult to investigate the layer alignment as it is concealed by the unfinished | MULTILAYER CIRCUITS TECHNOLOGIES | outer copper foil and prepregs. The results are extreme drill ...
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... not only the use of a precious metal, gold, which increases the price but especially the processing costs. The number of machine hours alone | MULTILAYER CIRCUITS TECHNOLOGIES | is far higher than for solder levelling as the facilities required are similarly complex to those for galvanization, which additionally require a complex waste water | MULTILAYER CIRCUITS TECHNOLOGIES | processing infrastructure. The immersion nickel gold process also requires staff intensive attention as the chemical baths call for a great deal of analysis and supervision | MULTILAYER CIRCUITS TECHNOLOGIES | due to the narrow processing slit. The process of solder mask coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match | MULTILAYER CIRCUITS TECHNOLOGIES | the gold plating. To prevent the risk of poor metallic deposition on the gold surface, vias must be completely free of solder mask coating or be | MULTILAYER CIRCUITS TECHNOLOGIES | completely closed by means of a special filling process. Curing of the solder mask coating must also concur with that of the chemical gold plating | MULTILAYER CIRCUITS TECHNOLOGIES | as it is exposed to hydrogen in the 90° C nickel baths. One has the ...
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... polymer that may be produced either in the horizontal mode using specially designed horizontal processing equipment or in the vertical mode using a standard | MULTILAYER CIRCUITS TECHNOLOGIES | immersion type plating line. The DMS-E system consistently delivers highly reliable plated through-holes on all commonly used laminate materials, PWB complexities and in a variety | MULTILAYER CIRCUITS TECHNOLOGIES | of operating conditions. Production-proven in both vertical and horizontal process equipment, the versatile system yields total process cost reduction Panel Plating a Flash of Copper | MULTILAYER CIRCUITS TECHNOLOGIES | The panels are online in a wet state transferred to our automatic electrolytic copper plating lines to get a flasch of copper.. The panels are | MULTILAYER CIRCUITS TECHNOLOGIES | attached to plating racks. When the racks are moved to the loading station, the system computer instructs the hoist to pick up the rack and | MULTILAYER CIRCUITS TECHNOLOGIES | begin the plating cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness 12 microns is deposited on the surface of | MULTILAYER CIRCUITS TECHNOLOGIES | the panel and on the walls of ...
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