... test programm discribing a network, including all signal lines (start and endings) generated out of the gerber data of the customer. As a middle | PCB INDUSTRY | and high volume manufacturer we use an adapter testing system that simultaneously tests all network lines and points of a PCB. The basic technology of | PCB INDUSTRY | adapter testing is, that conductive needles linked to the test machine are lead by an adapter to the test points of the PCB. The test | PCB INDUSTRY | result is then compared to the electrical network. A failure is detected if a network resistance is measured * bigger than 50 Ohm (cut) * | PCB INDUSTRY | smaller 10 MOhm (short) PCB`s tested without failure are marked by a green line on the edge of the PCB or by a stamp mark. | PCB INDUSTRY | Rejected PCB`s are separated, repaired and retested or finally rejected if repair is not feasible. The electrical test is not standard but we recommend it | PCB INDUSTRY | to the customer if the following features are given: * high circuit complexity * trace/gap smaller 200µ * embedding circuits in ground layers ...
[ Pcb Industry ]... a job to production. STANDARDIZED DRAWING NOTES Bottleneck: Incomplete or inconsistent notes on the fabrication drawing. Open Road: Fabrication drawings should include the board | PCB INDUSTRY | specification callout (or IPC-A-600); copper weight callout (1/2 oz., 1 oz., 2 oz., etc.); finish requirement (HASL, OSP, immersion gold, etc.); hole size tolerance; specify | PCB INDUSTRY | plated vs. non-plated holes; silkscreen color; board thickness and thickness tolerance; route tolerance; scoring specification; quality requirements such as cross section, ionic readings, certificate of | PCB INDUSTRY | compliance, impedance readings with coupons, solder sample, electrical test certificate, etc.; pack and ship instructions; and an impedance requirement that does not reflect line width | PCB INDUSTRY | or dielectric callout. NON-FUNCTIONAL LANDS Bottleneck: Non-functional lands for the CAM engineer and the manufacturing process engineer are a menace. Not only must the CAM | PCB INDUSTRY | engineer engage in a secondary DfM to remove them, but this same process may also ...
[ Pcb Industry ]... is 2.4 mm. The boards are milled in accor-dance with the dimensionlayer, which must be a separate layer containing just the unbroken contour of | PCB INDUSTRY | the boards (edge markings or drawings are not suitable and result in additional charge). | SELECTED CAPABILITIES: | Archiving Process Data Drill- / Milling Program | PCB INDUSTRY | Archiving Customer Data Production Data Conversion E-Test optional Design Check UL - approval Design Adjustment Further Options | TECHNICAL SPECIFICATION: | "Delivery: Multi-Panel (MP): Delivery-Size | PCB INDUSTRY | of the Panelized Board Array is 490 mm x 290 mm with Fixing Tabs by Min-Distance between the Boards of 2,4 mm. | MILLING-COORDINATES [-?-]: | PCB INDUSTRY | | One MAA-Unit (MAA-U) is made up of 20 MAA´s | DATA-BASE FORMAT: | Gerber, ODB++, DPF Type of the Base Material: FR 4 Layers: | PCB INDUSTRY | 1, 2, 4 | SURFACE PROTECTION: | HAL Layer Build-Up: | ELECTRICAL TESTING: | No Final Thickness of PCB: 1,00 mm to 2,40 mm Junction | PCB INDUSTRY | in Line-Production: No Min. Track Width + Spacing: 200µ / 200 µ | SMALLEST PAD: | 0,80 ...
[ Pcb Industry ]