... die damit verbundenen Nachteile auf... | PREISVERÄNDERUNG IN CHINA | Die Vorprodukte*, Metalle. Gestiegene Rohstoffkosten setzen die Elektronikbranche weltweit unter Druck. Von Jahresanfang bis | PCB SERVICES | Ende Mai stiegen die Weltmarktpreise für Metalle (Ag, Al, Au, Cu, Ni, Sn) stark an. Zwar fielen die Notierungen bis Anfang August wieder, sind aber | PCB SERVICES | immer noch erheblich höher als zu Jahresbeginn. Stellvertretend für alle Metalle sei hier Kupfer genannt. Der Kupferpreis stieg von... | MAKROÖKONOMISCH VOLLKOMMEN IDIOTISCH | Auszug | PCB SERVICES | aus "Markt&Technik" Nr. 23 vom 03.06.2005 zum Thema "Standort Deutschland II" | TROTZ SCHLECHTER RAHMENBEDINGUNGEN | - dass sich Leiterplatten auch am Standort Deutschland wett- | PCB SERVICES | bewerbsfähig produzieren lassen, davon ist Andreas Brüggen, Geschäftsführer von Precoplat, überzeugt. | DIE FRAGE, OB MAN IN DEUTSCHLAND NOCH WETTBEWERBSFÄHIG PRODUZIEREN KANN |, ist eindeutig | PCB SERVICES | mit »ja« zu beantworten. Die Grundvoraussetzungen sind zwar meiner Meinung nach schlechter als je ...
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... is aligned to the top and bottom circuit films and a vacuum pump removes the air between the panel and the film. Exposure is | PCB SERVICES | controlled by an integrator located near the panels.The imaging process is carried out in a controlled environment to minimise the effects of temperature and humidity | PCB SERVICES | variation and maximise the yield of quality product. After exposure, the panel is ejected from the exposure system and loaded onto an accumulator. Developing Image | PCB SERVICES | After the panel has been exposed, it is finally developed to remove all areas of unexposed resist. The chemistry in the developer is controlled by | PCB SERVICES | an automatic replenishment system. This fully automatic system assures consistent and uniform development and eliminates down time for cleaning and replacement of the chemistry. The | PCB SERVICES | copper tracks and pads thus defined are then ready for the electrolytic plating process or for etching. Remaining resist acts as an etchant barrier. Following | PCB SERVICES | development, all panels pass through Automatic ...
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... complicated electrolytic or chemical procedures, OSP is basically just a one- step process. Chemical tin, chemical silver and chemical nickel-gold are therefore, far more | PCB SERVICES | expensive; HAL only marginally so. DOUBTS– JUST A EUROPEAN ATTITUDE? So, what are the disadvantages ? European users, in particular, can list quite a few: | PCB SERVICES | the predominant one being, that for mixed components and other multi-thermic processes, the organic protection layer breaks off at temperatures above 150? C . All | PCB SERVICES | in all, the area of use for soldering at higher melting temperatures has not yet been reliably tested. In addition, OSP does not bond. The | PCB SERVICES | ability to bond with soldering paste – in particular with lead-free soldering paste – depends greatly on the soldering procedure, such as convection ovens with | PCB SERVICES | or without a nitrogen atmosphere, high cooker ovens, etc Tests so far show that bonding is not as good as with the other named surfaces. | PCB SERVICES | Therefore, the self-centralising effect is noticeably lower and ...
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