... further processing and continued use. Due to the thin surface layer – a thickness of 0.15 – 0.3 mµ is recommended – the surface | PCB TECHNOLOGIES | of the pad is smoother and therefore there are, even in fine pitch areas, no restrictions when assembling. The silver functions merely as a protection | PCB TECHNOLOGIES | against oxidation, and the actual solder point is between the copper and chemical tin, therefore the solder point is absolutely stable. It fulfills all UL | PCB TECHNOLOGIES | requirements (UL796 specif.) and meets the usual requirements of automobile manufacturers: Test AlphaSTAR Result Requirement SIR 85°C/85%RH 2.46+9 24h Passed >1E+8;IPC-4553 IPC-TM-650 2.6.3.5. 3.15E+9 96h | PCB TECHNOLOGIES | Passed SIR 35°C/85%RH 100VDC 3.56E+11 24h Passed >1E+10;IPC-4553 and GR-78 (Bellcore) IPC-TM-650 2.6.3.5 4.62E+11 96h Passed EM 10V bias, 100V Test, 2.46E+9 24h initial Resistance | PCB TECHNOLOGIES | no higher than the Power of 10 85°C/85%RH 1.18E+10 504 h (21 days) Passed Dendrites not Identified IPC-TM-650 2.6.14.1 Dendrites not Identified Passed IPC-4553 and | PCB TECHNOLOGIES | J-STD-004 ...
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... edge definition and traces dense enough for blocking light when photographing. - Preferred on 7mil (178mm) thick base for stability. Films should be plotted | PCB TECHNOLOGIES | on laser photoplotter or on vector photoplotter using a minimum resolution of ½mil (13mm). - Preferred in Gerber® format although accepted in other formats. (Refer | PCB TECHNOLOGIES | to CID- 014 for information on Documentation in Digital Form). - files are the only acceptable form of supplying images for multilayers and boards with | PCB TECHNOLOGIES | fine (0.2mm or smaller) tracks. Drawings Drawings must be supplied with each new job and should contain the following information to ensure that the finished | PCB TECHNOLOGIES | board is to your requirements. - Always required even when a drill file is supplied, to enable inspection of panels immediately after drilling and finished | PCB TECHNOLOGIES | boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not required unless different to our standard | PCB TECHNOLOGIES | of +0.1 / -0.05 mm. - ...
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... types of layers lead to huge file sizes. Negative plane layers are usually preferred by fabricators because they're easier to work with and have | PCB TECHNOLOGIES | smaller file sizes than positive layers. Remember, boards are manufactured en masse and must be stepped out into a panelized form. The result: Data sets | PCB TECHNOLOGIES | with lots of unnecessary positive planes swell exponentially, bog down CAM systems, and crash photoplotters. After the basic prep work is completed, step into the | PCB TECHNOLOGIES | fabrication analysis arena, where the game is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and balances can resolve | PCB TECHNOLOGIES | any conflicts between the two. Take soldermask layers, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that is, there is | PCB TECHNOLOGIES | not much in the way of capability checking within the tool. As a result, these are among the more troublesome layers for fabricators. The solution | PCB TECHNOLOGIES | here is a fabrication analysis tool that can handle such issues as ...
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