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... far provided unsatisfactory results, meaning that the lead-free problem has yet to be resolved. The chemical nickel-gold procedure (Imm NiAu) was unsuccessful due to | PRINTED CIRCUIT BOARDS FAB | high costs, as was chemical tin. Both procedures have proven to be very complicated and sensitive in the further course of processing management. Lead-free solderings | PRINTED CIRCUIT BOARDS FAB | also have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher processing temperatures and copper leaching effects. would briefly like to explain | PRINTED CIRCUIT BOARDS FAB | why chemical silver is the lead-free procedure of the future, and why it will be the focus of our future investments in the field of | PRINTED CIRCUIT BOARDS FAB | surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of copper and | PRINTED CIRCUIT BOARDS FAB | the more “precious” silver. The advantages of this processing manner compared with chemical tin are fewer processing steps and lower rinsing temperatures ...
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... issue: | THE SOLDERMASK | webbing between pads on fine-pitch surface mount devices. Most masks can go to 0.003" without the resist flaking off. | PRINTED CIRCUIT BOARDS FAB | However, if the pads are so tightly grouped that the dams between them are less than 0.003", it's better to construct a mask opening over | PRINTED CIRCUIT BOARDS FAB | the entire group. That will make the fabricator's life much simpler. Bear in mind that a | FABRICATOR'S | spacing tolerances likely differ from yours. | PRINTED CIRCUIT BOARDS FAB | For example, take the drill data. When laying out a board, you usually work with finished hole sizes. However, a fabricator must drill a hole | PRINTED CIRCUIT BOARDS FAB | larger than the finished one, about 0.004" to 0.005" over, then plate down to the desired finished size. This can lead to problems in maintaining | PRINTED CIRCUIT BOARDS FAB | annular ring requirements and copper spacing on internal layers. To meet manufacturing specs, the fabricator might have to modify the data, and that's the last | PRINTED CIRCUIT BOARDS FAB | thing you want. So now we have an alternate reality: You've finished the | PCB LAYOUT | (check out those ...
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... be read by most CAM tools automatically. For netlists, | IPC-D-356 | is the preferred format for fabrication. It's widely used by many of | PRINTED CIRCUIT BOARDS FAB | the bare-board test-fixturing machines and is one of the only true ways to identify power- to-ground shorts. With the information in this format coming directly | PRINTED CIRCUIT BOARDS FAB | from the engineering CAD system, there's no danger of the fabricator "reverse engineering" the netlist from the Gerber files. Next up are the internal | | PRINTED CIRCUIT BOARDS FAB | PLANE LAYERS |. For some reason, CAD engineers like them to be "positive," but those types of layers lead to huge file sizes. Negative plane | PRINTED CIRCUIT BOARDS FAB | layers are usually preferred by fabricators because they're easier to work with and have smaller file sizes than positive layers. Remember, boards are manufactured en | PRINTED CIRCUIT BOARDS FAB | masse and must be stepped out into a panelized form. The result: Data sets with lots of unnecessary positive planes swell exponentially, bog down CAM | PRINTED CIRCUIT BOARDS FAB | systems, and crash photoplotters. After the basic | PREP WORK | is completed, step ...
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