... now completed and covers the necessary changes concerning base material, PCB design and the supply chain up to the product ready for use. Since | PRINTED CIRCUIT BOARDS PROTOTYPING | 2004 we deliver our customers with RoHS compliant PCBs in different surface finishes – including also lead free Hot-Air-Levelling, Immersion Tin, Immersion Silver and Immersion | PRINTED CIRCUIT BOARDS PROTOTYPING | Gold. More | UL-APPROVAL | The letters UL stand for Underwriters Laboratories Inc., this organization is an independent, not-for-profit product-safety testing and certification organization. | | PRINTED CIRCUIT BOARDS PROTOTYPING | IN THE BEGINNINGS OF UL | more than 100 years ago stood questions in the range of fire-protection-mechanisms in the foreground. Today all possible products, | PRINTED CIRCUIT BOARDS PROTOTYPING | materials, constructions and systems are tested and evaluated regarding their electrical danger as well as their danger of accident and fire. And in addition there | PRINTED CIRCUIT BOARDS PROTOTYPING | were examined alarm systems and the ability to discover, control and prevent fire. | UL DEVELOPS SAFETY | regulations, which are taken over frequently as | PRINTED CIRCUIT BOARDS PROTOTYPING | ANSI ...
[ Printed Circuit Boards Prototyping ]


... and design issues must be addressed before adventuring down this path. Due to the many additional oper- ations, the cost of a blind or | PRINTED CIRCUIT BOARDS PROTOTYPING | buried via board is significantly higher than that of a multilayer of the same layer count. | BURIED VIAS | A buried via is a | PRINTED CIRCUIT BOARDS PROTOTYPING | copper-plated hole, imbedded in the board, that interconnects two internal layers. The buried via process starts by drilling holes on thin core laminate. These cores | PRINTED CIRCUIT BOARDS PROTOTYPING | are then metallised, imaged and etched before being laminated. Individual manufactuer´s method of fabricating multilayer boards mast be understood before designing bboards with buried vias. | PRINTED CIRCUIT BOARDS PROTOTYPING | Designed an manufactures layer sequence must match | BLIND VIAS A BLIND VIA | is a copper-plated hole that interconnects a board's external layer to | PRINTED CIRCUIT BOARDS PROTOTYPING | one or more internal layer(s) but not through to the other external layer. There are two possible methods of achieving blind vias. The first and | PRINTED CIRCUIT BOARDS PROTOTYPING | oldest is by pre drilling and metallisation the external cores before lamination. ...
[ Printed Circuit Boards Prototyping ]


... help you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can | PRINTED CIRCUIT BOARDS PROTOTYPING | be supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard that will | PRINTED CIRCUIT BOARDS PROTOTYPING | enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could | PRINTED CIRCUIT BOARDS PROTOTYPING | be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made | PRINTED CIRCUIT BOARDS PROTOTYPING | inside out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. ARTWORKS Scale must be | PRINTED CIRCUIT BOARDS PROTOTYPING | given, tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. PENPLOTS Scale must | PRINTED CIRCUIT BOARDS PROTOTYPING | be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking ...
[ Printed Circuit Boards Prototyping ]