Printed Circuit Boards Technologies Coating materials specifically designed for use in the manufacture of printed circuit boards.

... next working day.. 5.) Shipment by Courier: Delivery time depends on the distance to delivery destination. The goods are collected from us by a | PRINTED CIRCUIT BOARDS TECHNOLOGIES | courier/taxi immediately upon completion and Delivered to the client. 6.) Shipment by Self-Collection: We inform you as soon as the goods are ready. | ONLINE | PRINTED CIRCUIT BOARDS TECHNOLOGIES | ORDERING | > What do you mean by status of 1,2 etc.? Status-0 Article is filed in the shopping basket for calculation purposes, but no | PRINTED CIRCUIT BOARDS TECHNOLOGIES | order and no data have been sent. Status-1 Order is placed, but the production data are missing. Please send your data. Status-11 The agreed down | PRINTED CIRCUIT BOARDS TECHNOLOGIES | payment has not been transferred to our bank or PayPal account yet. After receipt of your bank transfer we put you on status-1, followed by | PRINTED CIRCUIT BOARDS TECHNOLOGIES | a confirmed eMail. After the confirmation of status-1 please log into your shopping basket and load up your files. to complete your order Send us | PRINTED CIRCUIT BOARDS TECHNOLOGIES | your data only over the shopping basket to ensure a proper procedure. If your transfer has not been received within the next ...
[ Printed Circuit Boards Technologies ]


... gold process also requires staff intensive attention as the chemical baths call for a great deal of analysis and supervision due to the narrow | PRINTED CIRCUIT BOARDS TECHNOLOGIES | processing slit. The process of solder mask coating as well as deoxidation of bare copper surfaces (activation) must perfectly match the gold plating. To prevent | PRINTED CIRCUIT BOARDS TECHNOLOGIES | the risk of poor metallic deposition on the gold surface, vias must be completely free of solder mask coating or be completely closed by means | PRINTED CIRCUIT BOARDS TECHNOLOGIES | of a special filling process. Curing of the solder mask coating must also concur with that of the chemical gold plating as it is exposed | PRINTED CIRCUIT BOARDS TECHNOLOGIES | to hydrogen in the 90° C nickel baths. One has the choice between an expensive coat-ing system or a subsequent infrared solidification which, in turn, | PRINTED CIRCUIT BOARDS TECHNOLOGIES | also calls for further investment in facilities. The potential for a lead-free alternative For a lead free altenative provided the PCB manufacturer ensures optimal conditions | PRINTED CIRCUIT BOARDS TECHNOLOGIES | for immersion nickel gold coating, the results of wave soldering are equally ...
[ Printed Circuit Boards Technologies ]


... each new job and should contain the following information to ensure that the finished board is to your requirements. - Always required even when | PRINTED CIRCUIT BOARDS TECHNOLOGIES | a drill file is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented | PRINTED CIRCUIT BOARDS TECHNOLOGIES | with distinct differences between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical | PRINTED CIRCUIT BOARDS TECHNOLOGIES | dimensions including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our | PRINTED CIRCUIT BOARDS TECHNOLOGIES | standard of + / -0.25 mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder | PRINTED CIRCUIT BOARDS TECHNOLOGIES | mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer | PRINTED CIRCUIT BOARDS TECHNOLOGIES | and fine line production ...
[ Printed Circuit Boards Technologies ]