... processing slit. The process of solder mask coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match the gold plating. | PRINTED WIRING BOARDS MANUFACTURING | To prevent the risk of poor metallic deposition on the gold surface, vias must be completely free of solder mask coating or be completely closed by | PRINTED WIRING BOARDS MANUFACTURING | means of a special filling process. Curing of the solder mask coating must also concur with that of the chemical gold plating as it is | PRINTED WIRING BOARDS MANUFACTURING | exposed to hydrogen in the 90° C nickel baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, in | PRINTED WIRING BOARDS MANUFACTURING | turn, also calls for further investment in facilities. THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel | PRINTED WIRING BOARDS MANUFACTURING | gold coating, the results of wave soldering are equally good to solder levelling. Good storage ability is also achieved by covering the pad and smd | PRINTED WIRING BOARDS MANUFACTURING | sides with gold. In our opinion, however, immersion nickel / gold will never become ...
[ Printed Wiring Boards Manufacturing ]


... and finally a selective heavy gold plating in the desired contact area. | SEMI-ADDITIVE-PROCESS | An additive process for obtaining conductive patterns which combines | PRINTED WIRING BOARDS MANUFACTURING | an electroless metal deposition on an unclad substrate with electroplating or with etching, or with both | SMOBC SOLDER MASK OVER BARE COPPER. | A | PRINTED WIRING BOARDS MANUFACTURING | method of fabricating a printed wiring board which results in the final metallization being copper with no other protective metal but the non soldered areas | PRINTED WIRING BOARDS MANUFACTURING | are coated by a solder resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing | PRINTED WIRING BOARDS MANUFACTURING | them to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a | PRINTED WIRING BOARDS MANUFACTURING | liquid (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 | PRINTED WIRING BOARDS MANUFACTURING | F liquid to cool it and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS ...
[ Printed Wiring Boards Manufacturing ]


... position, allowing us to compete with the best in quality, efficiency and delivery on time. Approximately 500 companies of the electronic industry, automotive, telecommunication, | PRINTED WIRING BOARDS MANUFACTURING | medical devices, aviation appliances and computer networking benefit from the quality of our products and services. On the company`s plant of 25.000 sqm we are | PRINTED WIRING BOARDS MANUFACTURING | able to produce 3.000 sqm of single-sided, 8000 sqm double- sided PCBs and 10.000 sqm Multilayer per month. Product Informations -- Interconnect Carriers -- | Boards | PRINTED WIRING BOARDS MANUFACTURING | | Circuits | PCBs | PWBs | PCB Carriers | Circuit Boards | Printed Wiring Boards | Printed Circuit Boards | Rigid Boards | Circuit | PRINTED WIRING BOARDS MANUFACTURING | Cards | Printed Circuits | | Single Sided | Double Sided | Plated Through Hole | Multilayer Boards up to 12 Layers | | HDI | PRINTED WIRING BOARDS MANUFACTURING | (high density) Boards | | Buried Vias | Blind Vias | Embedded components | In Fine-Line | in Micro-Fine-Line | in HDI-Technologie | Microvias in | PRINTED WIRING BOARDS MANUFACTURING | Laser- Technology SBU| | From Medium to High Volume | | Specifications in DIN | in MIL ...
[ Printed Wiring Boards Manufacturing ]