Printed Wiring Boards Production NPTH = Non plated through holes PCBs.

... AND TERMS OF PRINTED CIRCUIT BOARDS | | HOLE BREAKOUT | A condition in which a hole is not completely surrounded by the land. | PRINTED WIRING BOARDS PRODUCTION | | HOLE DENSITY | The quantity of holes in a printed board per unit area. | HOLE LOCATION | - The dimensional location of the | PRINTED WIRING BOARDS PRODUCTION | center of a hole. | HOLE PATTERN | The arrangement of all holes in a printed board. | HOLE PREPARATION | The hole prior to | PRINTED WIRING BOARDS PRODUCTION | plating shall be clean cut and free of burrs, loose or hanging fibers, copper dust and resin dust. | HOLE PULL STRENGTH | The force | PRINTED WIRING BOARDS PRODUCTION | (in pounds) necessary to rupture a plated-through hole when loaded or pulled in the direction of the axis of the hole. | HOLE |Void A | PRINTED WIRING BOARDS PRODUCTION | void in the metallic deposit of a plated-through ...
[ Printed Wiring Boards Production ]


... Process and Fully-Additive Process. | ADHESION PROMOTION | The chemical process of preparing a plastic surface to provide for a uniform, well-bonded metallic overplate. | PRINTED WIRING BOARDS PRODUCTION | | ADHESIVE | A wide range of materials including animal and vegetable type glues, rubbers, elastomers, thermosetting and thermoplastic resins, ceramics, and hot melts. Adhesives | PRINTED WIRING BOARDS PRODUCTION | are used extensively for bonding, sealing and joining laminates, films and foils, coils, conductors, etc. | ALIGN | The process of making two elements or | PRINTED WIRING BOARDS PRODUCTION | processes meet properly. | ANALOG CIRCUIT | A circuit comprised mostly of discrete components (i.e., resistors, capacitors, transistors) which produces data represented by physical variables | PRINTED WIRING BOARDS PRODUCTION | such as voltage, resistance, rotation, etc. | ANNEAL TEMPERN | To heat a metal and cool slowly to relieve hardness or brittleness that may have | PRINTED WIRING BOARDS PRODUCTION | occurred naturally or have been induces by pressure or bending. | ANNULAR RING | That portion of conductive material completely surrounding a hole. ...
[ Printed Wiring Boards Production ]


... electrolytic or chemical procedures, OSP is basically just a one- step process. Chemical tin, chemical silver and chemical nickel-gold are therefore, far more expensive; | PRINTED WIRING BOARDS PRODUCTION | HAL only marginally so. DOUBTS– JUST A EUROPEAN ATTITUDE? So, what are the disadvantages ? European users, in particular, can list quite a few: the | PRINTED WIRING BOARDS PRODUCTION | predominant one being, that for mixed components and other multi-thermic processes, the organic protection layer breaks off at temperatures above 150? C . All in | PRINTED WIRING BOARDS PRODUCTION | all, the area of use for soldering at higher melting temperatures has not yet been reliably tested. In addition, OSP does not bond. The ability | PRINTED WIRING BOARDS PRODUCTION | to bond with soldering paste – in particular with lead-free soldering paste – depends greatly on the soldering procedure, such as convection ovens with or | PRINTED WIRING BOARDS PRODUCTION | without a nitrogen atmosphere, high cooker ovens, etc Tests so far show that bonding is not as good as with the other named surfaces. Therefore, | PRINTED WIRING BOARDS PRODUCTION | the self-centralising effect is noticeably lower and requires ...
[ Printed Wiring Boards Production ]