... laser drilling, plasma, and photo (liquid or film) formation. This article will concentrate on the first two techniques. The choice of which drilling technology | WIRING BOARD | to use depends upon material properties and desired hole diameter. Figure 3 is a synopsis of hole manufacturing technology capabilities. The most established microvia technology, | WIRING BOARD | mechanical drilling, has existed since the first generation of | SINGLE-SIDED PCBS |, and it has proved surprisingly adaptable as via sizes decrease, densities increase, | WIRING BOARD | and the complexity of multilayer boards (MLBs) escalates. Automated mechanical drilling systems equipped with multiple spindles, control-depth positioning, and high-velocity positioning tables can process several | WIRING BOARD | panels simultaneously to achieve higher throughput and lower processing costs. Mechanical drilling is an effective method for hole diameters larger than 0.010" (250 microns). Below | WIRING BOARD | 0.010", however, operational costs rise exponentially. For example, a manufacturer ...
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... hole in a Printed Circuit Board that is used to provide electrical connection between a trace on one side of the Printed Circuit Board | WIRING BOARD | to a trace on the other side. Since it is not used to mount component leads, it is generally a small hole and pad diameter. | WIRING BOARD | | FIDUCIAL OPTICAL TARGET |. Also called OS. | FINAL COPPER THICKNESS | The copper thickness stated in the PCB specification. This thickness is to | WIRING BOARD | be understood as the total thickness of copper foil + copper plating. Fine-pitch SMD component with center-to-center terminal distances of less than 0,635 mm. Fluxing | WIRING BOARD | The process of removing oxides from a PCB to prepare it for soldering. Fluxing lowers the surface tension of the solder and helps promote the | WIRING BOARD | formation of good solder fillets. Foil A thin continuous sheet of metal, usually copper or aluminum, used as the conductor for printed circuits. Foils used | WIRING BOARD | for printed circuits are commonly 1 or 2 ounces per square foot the thinner the foil, the lower the required etch ...
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... the chemical silver refinement uncomplicated and reliable, but once the manufacturing parameters have been set they can be dependably utilised for further processing and | WIRING BOARD | continued use. Due to the thin surface layer – a thickness of 0.15 – 0.3 mµ is recommended – the surface of the pad is | WIRING BOARD | smoother and therefore there are, even in fine pitch areas, no restrictions when assembling. The silver functions merely as a protection against oxidation, and the | WIRING BOARD | actual solder point is between the copper and chemical tin, therefore the solder point is absolutely stable. It fulfills all UL requirements (UL796 specif.) and | WIRING BOARD | meets the usual requirements of automobile manufacturers: Test AlphaSTAR Result Requirement SIR 85°C/85%RH 2.46+9 24h Passed >1E+8;IPC-4553 IPC-TM-650 2.6.3.5. 3.15E+9 96h Passed SIR 35°C/85%RH 100VDC | WIRING BOARD | 3.56E+11 24h Passed >1E+10;IPC-4553 and GR-78 (Bellcore) IPC-TM-650 2.6.3.5 4.62E+11 96h Passed EM 10V bias, 100V Test, 2.46E+9 24h initial Resistance no higher than the | WIRING BOARD | Power of 10 ...
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