... After scrubbing, the panels are rinsed with a high pressure spray to remove any drill dust or debris in the holes. The high pressure | WIRING BOARDS | rinse is followed by a final fresh water rinse. The panels are then dried in preparation for electroless copper deposition. The scrubbing line is equipped | WIRING BOARDS | with an automatic loader and unloader and may be run unattended Alkaline Permanganate: Smear Removal Before direct metallization, the drilled holes on multilayers have to | WIRING BOARDS | be desmeared. The main purpose of this treatment is to remove any epoxy smeared onto the edge of the inner layer copper pads whilst drilling. | WIRING BOARDS | The smear is the result of a hot drill melting the epoxy resin and spreading it across the hole wall during its up and down | WIRING BOARDS | motion. The epoxy smear causes poor and in some cases non electrical continuity to the innerlayers as well as poor adhesion of the plated copper | WIRING BOARDS | to the hole wall. In desmear, the chemical attack is designed to remove only the surface smear of resin from the hole wall, ...
[ Wiring Boards ]


... has no components installed. | BASE COPPER | The thin copper foil portion of a copper- clad laminate for PCB's that can be present | WIRING BOARDS | on one or both sides of a board. | BASE MATERIAL | The insulating material upon which the conductive pattern may be formed. The base | WIRING BOARDS | material may be rigid or flexible. | BASIC DIMENSION | A numerical value used to describe the theoretical exact location of a feature or hole. | WIRING BOARDS | It is the basis from which permissible variations are established by tolerance on other dimensions, in notes, or by feature control symbols. | BLIND VIA | WIRING BOARDS | | A plated through hole, connecting inner layers of multilayer board, that penetrates to one Outer-Layer. | BLISTER | A localized swelling and separation between | WIRING BOARDS | any of the layers of a laminated base material, or between base material and conductive foil. It is a form of delamination. | BOND STRENGTH | WIRING BOARDS | | A measure of force or pressure required to separate a layer of material from its base. This may be measured as peel strength, in ...
[ Wiring Boards ]


... we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can be supplied as artworks, penplots, photoplots | WIRING BOARDS | or photoplot files, so long as the quality and registration of the images is of a standard that will enable a good quality board to | WIRING BOARDS | be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could be the board reference so long | WIRING BOARDS | as it cannot be read from the other side. (This is for your protection to prevent the boards made inside out). Images should comply with | WIRING BOARDS | design rules that will result in a board that will meet performance and cost requirements. - Scale must be given, tapes securely stuck to the | WIRING BOARDS | backing sheet, track to pad & track to track joints complete and the backing sheet clean. - Scale must be given and be at least | WIRING BOARDS | 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light when photographing. - Preferred on 7mil ...
[ Wiring Boards ]